Wafer Debonders
The Brewer Science® semiautomatic debonder product line enables safe debonding of thinned wafers in a laboratory setting. ZoneBOND
These permit development engineers to complete the final step of processing thinned full wafers in a confidential developmental setting. These precision tools facilitate internal small-scale prototyping to accelerate product development cycles and improve time to market for new ultrathin wafer technologies.
Cee® 1300DB thermal slide debonder
Cee® 1300CSX semiautomatic thermal slide debonder
ZoneBOND™ separation tool