Cee® 1300DBSemiautomatic Benchtop Debonder

The Brewer Science® Cee® 1300DB semiautomatic debonder enables high-temperature slide-off debonding of thinned wafers in a laboratory setting. This tool permits development engineers to complete the final step of thinned full wafer processing in a confidential developmental setting. Internal small-scale prototyping capability may be used to accelerate product development cycles and improve time to market for new ultrathin wafer technologies.

Benefits

  • Design permits in-house debonding of fully processed, proprietary ultrathin device wafers
  • Data logging feature provides detailed process feedback and record keeping
  • PC control allows virtually unlimited log storage
  • Small footprint permits installation flexibility

Utility Requirements & Dimensions

  • Exhaust: 30 cfm
  • Electrical: 208 V, single phase, 50/60 Hz, 6500 W
  • Nitrogen or CDA: 70 psi, 1 cfm
  • Dimensions: 66.5" L x 32.5" D x 52.5" H (170 cm L x 82 cm D x 130 cm H)
  • Weight: 187 kg

Other Specifications

  • Platen Maximum Temperature: 300°C
  • Substrate Sizes (round): 3 in, 100 mm, 150 mm, 200 mm, 300 mm
  • Constant Force Mode: 0 to 100 lb
  • Constant Speed Mode: 0 to 100 mm/s
  • Logging: Force, distance, temperature

Brewer Science® Thin-Wafer Handling Solutions

Brewer Science® solutions for thin wafer handling combines materials, processes and equipment:

Chemical Release Technology Slide Debonding Technology ZoneBOND™ Technology (Beta Stage)
  • Room temperature debonding capability
  • Higher throughput capability
  • Compatible with 100- to 300-mm wafers

Video Demonstration

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