Developers

Developer Image Brewer Science® Cee® spray and puddle developers deliver track-quality performance, a revolutionary touch screen interface, and the utmost in chemical and process flexibility in an efficient, space-saving design.

Developing photosensitive film layers with targeted feature sizes is a critical process step in any lithography exposure application. Applications engineers have created several process techniques for performing this step with tank immersion (bath) and/or several adaptations of spin developing (single wafer) for patterning soluble features on the substrate surface. The use of immersion tank processes has steadily decreased over the past decade because of drawbacks associated with material consumption, non-uniform resolution, and the lack of agitation necessary for clearing high-aspect-ratio features for MEMS and advanced lithography. Additionally, increased throughput requirements and reduction in critical dimensions (CDs) have further shifted mainstream applications to single-wafer spray/puddle process flows performed on the track.

The standard configuration of Brewer Science® Cee® spray and puddle developers includes two side-spray V-line nozzles to evenly apply developer solution and deionized (DI) water across the substrate simultaneously. An open UHMW polyethylene lid provides spray nozzles mounted either outside the wafer plane, spraying inward from the center of the wafer out (puddle spray), or directly over the substrate for continuous (direct) spray applications. The side spray nozzles are factory positioned outside the wafer plane (side orientation) and ensure uniform deposition for all substrate sizes (2 inches to 200 mm). The spray nozzles can also be used in a puddle developer application by quickly applying material to the substrate at slow spin speeds and then reducing the speed to 0 rpm. During continuous spray applications, the wafer will continue to rotate at a relatively slow velocity.

Cee® 200XD Spray & Puddle Developer

Brewer Science® Cee® 200XD Developer

The Brewer Science® Cee® 200XD puddle and spray developer delivers track-quality performance, a revolutionary touch screen interface, and the utmost in chemical and process flexibility, in an efficient, space-saving design.

Benefits

  • Spray, puddle, and stream systems available
  • Onboard Windows®-based PC control for enhanced
    interface capabilities and connectivity
  • Configurable for direct-angle continuous and/or side-angle spray puddle develop
  • New compact design for minimized footprint
  • Full-color, 7-inch touch screen display
  • Teflon® spin bowl for maximum chemical compatibility
  • Durable wet-bench design that can be converted to a flange/deck mountable configuration

Developer Options

Spray Dispense (Puddle/Direct)

This option utilizes two spray nozzles to apply developer solution and deionized (DI) water. It uses an open UHMW lid with spray nozzles mounted either outside the wafer plane, spraying inward from the center of the wafer out (puddle spray), or directly over the substrate for continuous (direct) spray applications.

  • Uses 1-gallon pressure cans as reservoirs for developer solutions
  • Can use a maximum of four spray nozzles
  • Can be configured to accommodate up to four center puddle/direct dispenses

Stream Dispense (Puddle)

This option uses a standard automated dispense spinner and pressure cans. It functions by streaming developer and DI water onto the top of the substrate.

  • Very economical
  • Utilizes standard auto-dispense Lexan® lid
  • Uses suckback dispense valves
  • Minimizes material usage

DI Water Rinse

Both topside and backside DI water rinse options are available. This method of dispense is normally used in conjunction with a pressure can dispense or by using a house DI water supply.

Specifications

Programmability

  • Controlled by onboard Windows®-based PC
  • Touch screen interface and display
  • Full-color alphanumeric-capable graphical user interface (GUI)
  • 250,000 process recipe programs on board
  • Virtually unlimited number of user-defined recipe program steps
  • 0.1-second resolution for step times (maximum step time: 9,999.9 seconds)
  • Spin speed: 0 to 6,000 rpm (12,000 rpm option at no charge; 16,000 rpm option available)
  • Spin speed acceleration:
    0 to 30,000 rpm/s unloaded
    0 to 23,000 rpm/s with a 200-mm substrate
    0 to 3,000 rpm/s with a 6" x 6" x 0.25" photomask recessed chuck
  • USB and Ethernet ports for network connectivity and uploading/downloading process parameters with offline firmware (offline recipe number and steps unlimited)
  • System capable of controlling third-party host software for high-end IDI/Cybor/Mykrolis positive displacement pumps
  • Simultaneous dual automated dispense capability
  • Bidirectional speed control/oscillating chuck
  • Iteration software (recipe looping)
  • Dispense or component outputs: 50
  • Password protection security option available at no charge
  • In-process dynamic speed/acceleration control

Precision

  • Spin speed repeatability: < 0.2 rpm
  • Spin speed resolution: < 0.2 rpm
  • Substrate sizes: < 1 cm to 200 mm round; 7 inch x 7 inch square

Reliability

  • Indirect drive system protects the spin motor from contact with process chemicals and solvents
  • Vacuum and lid interlock
  • Industry-leading reliability and uptime
  • 1-year full warranty on parts and labor
  • Free remote technical support (phone, email, fax) for the life of the product
  • Application process assistance for life of the product

Bowl Design

  • Teflon® spin bowl for material compatibility
  • Integrated bowl ring to eliminate material migration
  • Optional stainless steel bowl (for all-stainless-steel construction)
  • Optional polyethylene bowl (educational package) available
  • Optional polyethylene liners available
  • Optional polyethylene/Teflon® splash ring
  • Closed and open lid designs available for process flexibility
  • Drain and exhaust ports located in the bottom of bowl
  • Optional nitrogen purge for an inert spin environment
  • Optional auto-N2 blow-off nozzle
  • Optional auto-drain separator (solvent/aqueous)

Dimensions

  • 13.25" W x 19" D x 18" H (33.65 cm W x 48.26 cm D x 45.72 cm H)
  • Machine Weight: 40 lb (18.1 kg)
  • Shipping Weight: 100 lb (45.4 kg)

Utilities

  • Voltage ranges: 100, 110-125, 208-240 VAC, 50/60 HZ
  • Power requirements: 655 watts (10 amps)
  • Drain Port: 3/4" OD
  • Exhaust Port: 1" OD
  • Vacuum: 20" to 25" Hg
  • Exhaust: 20 to 50 cfm
  • Nitrogen or CDA (for automated dispenses): 70 psi
  • DI water for developer spray and backside rinse (if hard plumbed); maximum flow: 80 PSI; regulator to be supplied by purchaser
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Cee® 300XDSpray & Puddle Developer

Cee® 300XD spray/puddle developer shown with X-Pro package

The Brewer Science® Cee® 300XD spray/puddle developer combines an intuitive Windows®-based operating system, extremely accurate spin speed control, and an extremely high horsepower drive for aggressive acceleration. The 300XD spray/puddle developer offers direct fan-jet spray, side-angle puddle, and stream dispense options. These features combine to ensure the elimination of process variables for a large array of process chemicals and applications. The 300XD has a state-of-the-art user interface and has been designed specifically for 300-mm round substrates and large LCD squares up to 14” × 14”.

Benefits

  • PC control for enhanced interface capabilities and connectivity
  • Enhanced Lid-lift assist feature (gas spring opens ≥45°)
  • Stand alone cabinet and streamlined design for minimized footprint (Chemical Storage)
  • X-PRO Workstation integrates stand alone cabinet with an upper exhaust enclosure for creating mini-environment (monitors and data logs ambient conditions)
  • Direct-angle continuous and/or side-angle spray puddle develop
  • New streamlined design for minimized footprint
  • Full-color, 7-inch touch screen display
  • Highest horsepower drive (indirect) system in its class

Developer Options

Spray, puddle and stream dispense options are offered on our Cee® Model 300XD. These dispense methods are normally used in conjunction with a pressure can dispenser which holds the developer.

Spray Dispense (Puddle/Direct)

This option utilizes two spray nozzles to apply developer
solution and deionized (DI) water. It uses an open UHMW lid with spray nozzles mounted either outside the wafer plane, spraying inward from the center of the wafer out (puddle), or directly over the substrate for continuous (direct) spray
applications.

  • Uses 1-gallon pressure cans as reservoirs for developer solutions
  • Can use a maximum of six spray nozzles
  • Can be configured to accommodate up to four center puddle/direct dispenses

Stream Dispense (Puddle)

This option uses a standard automated center dispense option with pressure cans. It functions by “streaming” the developer and DI water onto the top of the substrate.

  • Very economical
  • Utilizes standard auto-dispense Lexan® lid or open developer lid
  • Uses suck back dispense valves
  • Minimizes material usage

DI Water Rinse

Both topside and backside DI water rinse options are available. This method of dispense is normally used in conjunction with a pressure can dispense or by using a house DI water supply.

Specifications

Programmability

  • PC controlled
  • Touch screen interface and display
  • 250,000 spin process programs onboard
  • Virtually unlimited steps per spin program
  • 0.1 s resolution for step times with a range of
  • 0 to 9,999.9 s /step
  • Spin speed: 0 to 6,000 rpm (4000 rpm and 3000 rpm option  available for additional acceleration capabilities)
  • Spin speed acceleration:
    0 to 30,000 rpm/s unloaded
    0 to 23,000 rpm/s for 300-mm substrate
    0 to 3,000 rpm/s for 350-mm × 6-mm round recessed spin chuck
    0 to 400 rpm/s for 14-in × 14-in × 0.250-in photomask recessed chuck
  • Connectivity: USB/Ethernet port for communication of uploading/downloading process parameters with offline firmware standard (offline recipe number and steps unlimited)
  • System capable of controlling third-party host software for high-end IDI/Cybor/Mykrolis positive displacement pumps
  • Simultaneous trigger of multiple (up to 16) automated dispense nozzle capability
  • Bidirectional speed control/oscillating chuck
  • Iteration software (recipe looping)
  • Dispense or component outputs: 50
  • Security: password protection available at no charge
  • In-process/dynamic speed/acceleration control

Precision

  • Spin speed repeatability: < 0.2 rpm
  • Spin speed resolution: < 0.2 rpm
  • Substrate sizes: < 1 cm to 450 mm round; 14 in × 14 in square

Reliability

  • Indirect drive system protects the spin motor from accidental contact with process chemicals and solvents
  • Vacuum and lid interlock
  • Exceptional reliability and uptime
  • 1-year full warranty on parts and labor
  • Free remote technical support (phone, email, fax) for the life of the product
  • Application process assistance for life of the product

Bowl and Exhaust Hood Design

  • Stainless steel construction
  • Optional ETFE spin bowl for material compatibility
  • Optional polyethylene/Teflon® bowl non-disposable bowl liner
  • Closed and optional open lid design for process flexibility
  • Optional polyethylene/Teflon® splash ring
  • Drain and exhaust ports located in the bottom of bowl
  • Optional nitrogen purge for an inert spin environment
  • Optional auto nitrogen blow-off nozzle
  • Optional auto-drain separator (solvent/aqueous)

Dimensions

  • 27.75 in (70.5 cm) W × 34.75 in (88.3 cm)  L × 20.25 in (51.5 cm) H
  • Machine Weight: ~115 lb (52.2 kg)
  • Shipping Weight: ~250 lb (113.4 kg)

Utilities

  • Power requirements: 200-240 VAC, 1350 watts, 7.0 amp
  • Drain port: 1” OD
  • Exhaust port: 1.5” OD
  • Vacuum: 20-25” Hg
  • Exhaust: 20-50 cfm at 0.2” water
  • Nitrogen or CDA (for automated dispenses): 70 psi
  • DI water for developer spray and backside rinse (if hard- plumbed) max flow 80 psi regulator to be supplied by purchaser
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Cee® 300MXD Megasonic Developer/Cleaner

Cee® 300MXD megasonic developer/cleaner shown with X-Pro package

The Brewer Science® Cee® 300MXD megasonic developer/cleaner combines an intuitive Windows®-based operating system, megasonic transducer (ProSys MegPie), extremely accurate spin speed control, and a high-horsepower drive for aggressive acceleration. The radial megasonic array is specifically designed to apply uniform acoustic energy to spinning substrates. The Cee® 300MXD tool features a complementing stream puddle dispense for supplying developer/cleaner solutions to the wafer surface. These features combine to ensure enhanced development resolution and to mitigate risk to fragile device structures. This tool is also capable of removing < 0.15-µm particles when configured for post-develop or chemical-mechanical polishing (CMP) cleaning applications. The Cee® 300MXD developer/cleaner has a state-of-the-art user interface and has been designed specifically for wafer sizes ranging from 3 inches to 450 mm and for large LCD squares up to 14 in × 14 in.

Benefits

  • Onboard PC control for enhanced interface capabilities and connectivity Windows®-based operating system
  • Enhanced Lid-lift assist feature (gas spring opens ≥45°)
  • Stand alone cabinet and streamlined design for minimized footprint (Chemical Storage)
  • X-PRO Workstation integrates stand alone cabinet with an upper exhaust enclosure for creating mini-environment (monitors and data logs ambient conditions)
  • Flexible configuration for enhanced developing and cleaning applications for fragile device structures
  • Stand-alone cabinet and streamlined design for minimized footprint
  • Full-color, 7-inch touch screen display
  • Drive system (indirect) with highest horsepower in its class

Enhanced Process Applications*

  • Photoresist developing to produce high-aspect-ratio features for MEMS and advanced lithography (KrF/ArF)
  • Thick-film SU8 developing
  • Post-develop cleaning
  • Post-CMP cleaning
  • Photomask cleaning
  • Photoresist stripping
  • Metal lift-off (heated dispense optional)
  • Metal etching (heated dispense optional)

Dispense Options

Stream Dispense (Puddle)

This option uses a standard automated center dispense option with pressure cans. It functions by “streaming” the developer and DI water onto the top of the substrate.

The stream dispense option is:

  • Is very economical
  • Uses precision dispense valves with suckback control
  • Minimizes material usage
  • Is compatible with aqueous and solvent-based materials

Stream DI Water/Solvent Rinse

Brewer Science offers both topside and backside rinse options for cleaning applications. This dispense method is normally used in conjunction with a pressure dispense can or with a house DI water supply.

Specifications

Dimensions

  • Machine weight: 175 lb
  • Shipping weight: 450 lb
  • Cabinet dimensions: 35.75 in L × 29.0 in D × 59.50 in H

Programmability

  • PC-controlled Windows® operating system)
  • System capable of controlling ProSys MicroPulse host software for ProSys’s high-end Megasonic system.
  • User-friendly touch screen interface and display
  • 250,000 spin process programs
  • Virtually an unlimited number of steps per spin program
  • 0.1-second resolution for step times (time: 0-9,999.9 s/step)
  • Spin speeds of 0-6,000 rpm (optional 4000 rpm and 3000 rpm for additional acceleration capabilities)
  • Spin speed accelerations:
    0-30,000 rpm/s unloaded
    0-23,000 rpm/s 300-mm substrate
    0-3,000 rpm/s 350 mm × 6 mm round recessed spin chuck
    0-300 rpm/s 14 in × 14 in × .250 in photomask recessed chuck
  • Connectivity: USB/Ethernet port for communications for uploading/downloading process parameters with offline firmware standard (offline recipe number and steps unlimited)
  • Simultaneous trigger of multiple (up to 16) automated dispense nozzles
  • Bidirectional speed control/oscillating chuck
  • Iteration software (recipe looping)
  • Dispense or component outputs: 50
  • Security: Password protection option at no charge
  • In-process, dynamic speed acceleration control

Precision

  • Spin speed repeatability: < 0.2 rpm
  • Spin speed resolution: < 0.2 rpm
  • Substrate sizes: < 3 in to 450 mm round/14 in × 14 in square)

Reliability

  • Indirect drive system protects the spin motor from accidental contact with process chemical and solvents.
  • Vacuum and lid interlock standard
  • Industry-leading reliability and uptime
  • 1-year full warranty on parts and labor
  • Free live technical phone support for the life of the product
  • Application process assistance (live) for the life of the product

Bowl, Exhaust Hood, & Megasonic Transducer Design

  • All stainless steel construction
  • Drain and exhaust ports located in the bottom of bowl
  • Optional ETFE-coated spin bowl for material compatibility
  • Optional sapphire MegPie array for material compatibility
  • Optional Teflon®/polyethylene bowl non-disposable bowl liner
  • Optional exhaust hood (process chamber)
  • Optional fan filter unit (< Class 1 cleanliness inside process chamber)
  • Optional Teflon®/polyethylene splash ring
  • Optional nitrogen purge for an inert spin environment
  • Optional automatic N2 blow-off nozzle
  • Optional automatic drain separator (to separate aqueous and solvent-based fluids)

Utilities

  • Power requirements: 200-240 Volts A/C, 2350 Watts, 12.0 AMP
  • Drain port: 1 in OD
  • Exhaust port: 1.5 in OD
  • Recommended utilities: Vacuum: 20 in Hg, Exhaust 20-50 cfm
  • Auto-Dispense requirements: N2 or CDA: 70 psi (15 lpm)
  • Maximum flow for DI water for developer spray and backside rinse (if hard-plumbed): 80 psi, regulator to be supplied by purchaser

* - Patent-pending technology

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