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Cee® 1300X Precision Bake Plate

Brewer Science® Cee® 1300X Precision Bake Plate Request more information about the Cee® 1300X precision bake plate

The Brewer Science® Cee® 1300X precision bake plate features a revolutionary intuitive interface, a space-saving design, and track-quality thermal accuracy and uniformity.

Fully programmable and user-friendly, the Brewer Science® Cee® 1300X precision bake plate features the accuracy and repeatability needed to eliminate processing variability from critical experiments. Recipes are easily entered, monitored, and stored with the convenient full-color touch screen interface, and onboard Windows®-based PC controller. Compact footprint, intuitive design, and unequaled experience add up to years of high-performance bake step processing, perfect for any low-volume or R&D laboratory processing environment.

Benefits

  • Onboard Windows®-based PC control for enhanced interface capabilities and connectivity
  • New compact design for minimized footprint
  • Full-color, 7-inch touch screen display
  • Durable wet-bench design that can be converted to a flange/deck mountable configuration
  • Enhanced logging and programmable height control

Dimensions

  • 13.25 in (33.65 cm) W × 19 in (48.26 cm) D ×
  • 12 in (30.48 cm) H
  • Machine weight: 65 lb
  • Shipping weight: 148 lb

Programmability

  • Controlled by onboard Windows®-based PC
  • Touch screen interface and display
  • 250,000 bake process programs
  • Virtually unlimited steps per program
  • 0.1-s resolution for step times with a range of
  • 0 to 9,999.9 s/step
  • Three automated bake methods: contact, vacuum, proximity
  • Bake plate auto sizing for 3-in, 100-, 125-, 150-, and 200-mm  substrates
  • Temperature data recording
  • Ethernet port for network connectivity and uploading/downloading process parameters
  • Password protection available at no charge
  • Ramping capability optional (8 specific set points within single bake recipe)
  • Optional electronic lift pins (replace N2 proximity for loading/unloading substrates from bake module). Program 10 specific proximity heights above the surface in any sequence or combination. Height is programmed in 0.001-in increments with an overall range of 0.000 to 0.500 in.
  • Energy-saving capability (for predetermined temperature output control)

Precision

  • Substrate sizes: < 1 cm to 200 mm round; 8 in × 8 in square)
  • Temperature resolution: 0.1° C
  • Temperature range: ambient to 300°C (400°C optional)
  • Temperature uniformity: ± 0.3% across working surface

Reliability

  • Exceptional reliability and up-time
  • 1-year full warranty parts and labor
  • Free technical (live) phone support for the life of the product
  • Application process assistance (live) for life of the product
  • Exhaust bake hood design
  • All stainless steel construction
  • Exhausted hood for removal of process chemicals
  • Optional nitrogen purge for inert bake environment

Utilities

  • Voltage ranges: 100, 110-125, 208-240 VAC
  • Power requirements: 1057, 1683, 1555 watts per plate
  • (16.7 amps)
  • Exhaust port: 1 in OD
  • Vacuum: 20 to 25 in Hg
  • Exhaust: 5 to 10 cfm
  • N2 (for bake plate proximity): 35 psi