The Brewer Science^® Cee^® 1300DB semiautomatic debonder enables high-temperature slide-off debonding of thinned wafers in a laboratory setting. This tool permits development engineers to complete the final step of thinned full wafer processing in a confidential developmental setting. Internal small-scale prototyping capability may be used to accelerate product development cycles and improve time to market for new ultrathin wafer technologies.

Benefits

• Design permits in-house debonding of fully processed, proprietary ultrathin device wafers
• Data logging feature provides detailed process feedback and record keeping
• PC control allows virtually unlimited log storage
• Small footprint permits installation flexibility

Utility Requirements & Dimensions

• Exhaust: 30 cfm
• Electrical: 208 V, single phase, 50/60 Hz, 6500 W
• Nitrogen or CDA: 70 psi, 1 cfm
• Dimensions: 66.5 in L × 32.5 in D × 52.5 in H (170 cm L × 82 cm D × 130 cm H)
• Weight: 187 kg

Other Specifications

• Platen Maximum Temperature: 300°C
• Substrate Sizes (round): 3 in, 100 mm, 150 mm, 200 mm, 300 mm
• Constant Force Mode: 0 to 100 lb
• Constant Speed Mode: 0 to 100 mm/s
• Logging: Force, distance, temperature