CON-TACT® technology is a tool, material set and process for enhancing planarization of topography in the manufacture of semiconductor devices.

CON-TACT® technology consists of an optical flat to press planarity into a malleable substrate that has been placed over topography. Once hardened, the planar surface can be transferred into the topographic layer by etch or CMP. If the malleable layer is functional, e.g. BCB, the process is complete and ready for additional processing.