Debonding Technologies

Temporary Bonding Systems

Brewer Science temporary wafer bonding systems allow for safe handling and transport of ultrathin wafers during rigorous backside processing steps.

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Real solutions for ultrathin wafer handling

Our proven temporary wafer bonding systems are designed to fit into a variety of process scenarios with minimal disruption. We offer proprietary material and equipment sets for low-volume R&D environments, and we work with leading equipment vendors to provide fully automated solutions for higher-volume needs.

Work with the experts

Brewer Science was one of the first companies to recognize the potential of temporary wafer bonding for ultrathin wafer handling. Connect with one of our experts today to see how we can optimize your ultrathin wafer handling process.

Why ultrathin wafers?

Ultrathin wafers provide better heat dissipation, take up less space, and offer enhanced connectivity over conventional device wafers. By thinning device wafers after they have been processed, engineers can achieve the performance improvements and form factor reduction demanded by cutting-edge devices.

Why temporary bonding?

Ultrathin device wafers are extremely fragile and require a rigid support that allows the wafer to undergo further processing before it is diced and packaged. After surviving harsh processing conditions, the thin wafer must then be separated from the rigid support without resulting in damage.

Chemical Release System

Chemical Release IllustrationIdeal for low-volume R&D production environments, the chemical release system involves bonding the device wafer to a perforated carrier for further processing. After processing is completed, the bonded pair is placed in a solvent bath for separation.

Max ThroughputThermal StabilityLOW STRESS
25 WAFERS PER CYCLE*UP TO 220°C

*Wafers are separated using a batch process
Bonding Material: WaferBOND® CR-200 material

Thermal Slide Release System

Thermal Slide Release Illustration

In the thermal release system, the device wafer is bonded to a standard carrier wafer and later separated via a high-temperature “slide” process. Both manual and automated equipment sets are available, making the thermal release system ideal for low- to mid-volume production environments.

Max ThroughputThermal Stability
15 WPHUP TO 250°C

Bonding Material: BrewerBOND® 220 material

Mechanical Release System

The mechanical release system offers low-stress separation suitable for both low- and mid-volume production environments. In this system, the bonding material is paired with a special release material on the carrier wafer, making it possible to gently “peel” the wafers apart during separation.

Bonding Material: BrewerBOND® 220 material
Bonding Material: BrewerBOND® 305 material
Release Layer: BrewerBOND® 510 material

Max ThroughputThermal StabilityLOW STRESS
20 WPHUP TO 250°C

Laser Release System

Laser Release

In the laser release system, the device wafer is bonded to a transparent glass carrier using a bonding material and a release material. Once processing is completed, the pair is separated by exposing the release material with an excimer laser. Low-stress separation coupled with high throughput make the laser release system suitable for all production environments.

Max ThroughputThermal StabilityLOW STRESS
40 WPHUP TO 250°C

Bonding Material: BrewerBOND® 220 material
Bonding Material: BrewerBOND® 305 material
Release Layer: BrewerBOND® 701 material