Frequently Asked Questions

Helpful tips from the Brewer Science Applications Team

Q. How can a bottom anti-reflective coating (BARC) affect line edge roughness (LER)?
A. For EUV, the attenuation of out-of-band radiation is controlled by means of an assist layer, or underlayer, and LER can be reduced by using a Brewer Science^® E2^® Stack assist layer.

Q. What is the largest feature size that can be planarized with a spin-on coating?
A. With self-leveling materials, Brewer Science can planarize trenches of several microns without special equipment. We also have techniques and tools available to handle features of several hundred microns, enabling a broad range of micromechanical device options.

Q. Can through-silicon-via device wafers and carriers be debonded at room temperature?
A. Yes. The Brewer Science^® ZoneBOND^® process allows wafer debonding to occur at room temperature, protecting fragile devices.

Q. What type of point-of-use filter is appropriate for a given spin-coating material?
A. Contact Brewer Science Customer Care for filter recommendations. We have evaluated many materials with different media and filter types.

Did you know that...

Seasonal changes in temperature and humidity can cause a shift in your fab environment that can affect coated film uniformity.

By using a laser interferometer, it is possible to make line/space patterns smaller than 40 nm without a mask or scanner.

Optimizing the standing-wave pattern within a photoresist layer using ARC® anti-reflective materials, invented by Brewer Science, can produce a larger process window than simply minimizing reflectivity.

Common methods used to measure outgassing of spin-coated materials include the inverted wafer method, microbalance, quartz crystal method (QCM), and other analytical methods such as HPLC.

Properly priming the filter while using the proper purging process will result in quicker startup after filter changes.

Other FAQs

Advanced Packaging FAQs
Equipment FAQs
Lithography FAQs
MEMs FAQs