ProTEK^® SR coating increases yield by protecting front-side circuitry during the backside DRIE process.

Brewer Science is pleased to announce the development of a new innovative scratch-resistant protective coating solution for DRIE etch processes. ProTEK^® SR coating is a spin-applied polymeric coating designed to provide maximum protection for fragile, etch-sensitive circuitry placed in direct contact against the interior chuck of the etch chamber. ProTEK^® SR coating offers durability and longevity against harsh backside DRIE processes typically utilized by the microelectromechanical systems (MEMS) and integrated circuit (IC) industries.

ProTEK^® SR coating offers the following features:

• Durable polymer coating protects delicate front-side circuitry during backside DRIE etching.
• High film hardness (9H pencil) resists scratching.
• High glass transition temperature (117ºC) assures ProTEK^® SR film will not stick to DRIE chuck.
• Low outgassing in a vacuum assures no contamination of DRIE chamber or process.
• Low film ion levels prevent contamination of wafers, tools, and handling equipment.