ProTEK^® B3 coating protects front-side circuitry during deep alkaline bulk micromachining while increasing throughput and yield

ProTEK^® B3 thin films are spin-applied polymeric coating systems that provide temporary wet-etch protection for CMOS MEMS circuitry during alkaline or acid etches. ProTEK^® B materials offer protection from alkaline solutions such as KOH and TMAH for extended bath etches. ProTEK^® A2 materials provide protection for the substrate from either hydrofluoric acid (49% HF) or buffered oxide etchant (BOE) etch solutions.

With ProTEK^® B3, you can:

• Protect delicate front-side circuitry during back-side bulk micromachining
• Increase yield by minimizing front side damage caused by alkaline etch solution punch through during wet etch
• Improve throughput by reducing labor and process time associated with mechanical clamps and increasing the number of wafers per etch bath

Apply ProTEK^® B3 coating instead of mechanical clamps to:

• Protect CMOS circuitry or MEMS structures
• Create SiN membranes last
• Create through-silicon vias (TSVs)

Contact Brewer Science

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