BSI

Applications

The table below contains specific information about the current Specialty Materials products offered by Brewer Science and their appropriate application. Although this is not a comprehensive listing of all applications that these materials might be applicable, the list is designed to provide enough information to give you a sense of product capability.

Please do not hesitate to contact us for further assistance.

MEMS Applications

Direct write

Electron beam

Etch protection for wafer thinning

Free standing structures

Frontside substrate protection during backside v-groove etch process

Frontside substrate protection for wafer thinning

Hot embossing

Lift-off or sacrificial layers

LIGA mold

Light absorbing material

Microbridges

Metal lift-off

Microbridges

Micromirror

 Nano-imprint lithography

Protective coatings

Temporary coatings

Transparent passivation layer

Wafer dicing

Compound Semiconductor Applications

 Temporary wafer bond coatings

Optoelectronic Applications

Passivation layers

Smoothing layer

Alignment Coatings

In-Plane Switching (IPS)

Vertical Alignment (VA)

STN

TN

TFT


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