T-Polyim™ layers are a family of polyimide materials designed to provide extremely transparent, durable coatings at a range of thicknesses. They are ideally suited as passivation layers on top of silicon circuitry prior to the deposition of color filter materials. They may also be used as a "smoothing" layer on top of color filters prior to the deposition of ITO. T-Polyim™ materials may be patterned using photoresist and a ß-bake process. Benefits that T-Polyim™ materials provide include:

• Ultrapure polyimide with lower metal ion contamination and higher clarity than other commercially available polyimides.
• Consistent and repeatable performance characteristics due to extensive quality control during and after manufacturing.
• Improved adhesion on oxide, silicon, silicon nitride, aluminum, and copper for fully cured films. Beta stage cured T-Polyim™ films show improved adhesion in etching during photoresist development.
• Excellent thermal and superior electrical properties.
• Can produce single coat, spun films up to 6µm thick (after curing) when processed as recommended.
• Can be formulated in many viscosities to achieve the specifications needed for special process requirements.
• Supported with Brewer Science’s in-house chemical and lithography laboratories and experienced process engineers.

Brewer Science offers processing materials that compliment other products within our portfolio. These materials are listed below:

APX-K1 adhesion promoter is an organo-silane coupling agent designed to provide outstanding adhesion of Brewer Science color filter materials to a variety of substrates including soda-lime glass, borosilicate glass and silicon. It is normally necessary to apply the adhesion promoter once only at the beginning of the process. Repeated application prior to each color layer is not required.

Brewer Science SafeStrip™ is an organic solvent stripper designed to selectively remove photoresist from partly imidized polyamic acid films. It should be used in place of n-methyl pyrrolidinone (NMP) based strippers or acetone based strippers. NMP based materials will damage these materials when in the partly imidized state.