Brewer Science WaferBOND™ Materials for 3D Packaging and Compound Semiconductor Applications

 

 

Enabling high-temperature processing and increased throughput of ultrathin wafers

 

WaferBOND™ HT materials influence the viability of ultrathin wafers by enabling: 

  • High throughput
  • Process capability up to 220°C
  • Ultrathin wafer processing
  • Excellent uniformity

WaferBOND™ HT materials:

  • Protect the wafer edge from chipping
  • Protect circuitry from harsh chemical etchants
  • Provide a void-free interface for a smooth surface on the final thinned wafer

Added benefits include:

  • Low defects
  • High yield
  • Ability to be applied  and removed with EVG® bonding and debonding equipment platform specifically designed to work with WaferBOND™ HT materials.

Picture of full wafer (thinned to < 10 µm)

Debonding with the WaferBOND™ HT System

WaferBOND™ HT coating is mechanically debonded by heating the processed wafer until the carrier can be slid from the ultrathin wafer.

The WaferBOND™ HT system supports high throughput processes because of short debonding time. Debonding time is < 5 minutes.


Material design allows for rapid process throughput in debonding process.

Stripping Process for WaferBOND™ HT-250 Coating

• Residue-free vias with Brewer Science SafeStrip™ Stripper

• Reduced defects compared to existing technology


Via information: 0.7 µm wide and depth is 0.7 µm.


Improve throughput of high-temperature ultrathin-wafer processing

Excellent void-free bonding and high-temperature stability of the WaferBOND™ HT product series increases yields and provides greater process latitude.

For information about the EV Group® bonding and debonding equipment platform, please visit the EVG® website at www.EVGroup.com.

WaferBOND™ Temporary Coating

Brewer Science's WaferBOND™ product set combines a new spin-on polymer and a remover and is specially designed for temporary wafer bonding applications.


Polymer Features:

  • Single coat > 10 µm
  • Excellent chemcial resistance
  • Process resistance up to 180°C
  • No hazardous air pollutants
  • Transparent
  • Easily dissolved in WaferBOND™ Remover
 
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