Temporary Bonding Solutions
Thinned silicon wafers are fragile and require a temporary rigid support that allows the wafer to be successfully processed further for stacking. When finished, the thin processed wafer must be separated from the rigid support using a simple, cost-effective process, without resulting in damage.
The bonding materials used to attach the device wafer to the rigid support, or carrier, must meet very stringent requirements. They must survive extreme temperatures, harsh corrosive and solvent chemistries, and mechanical stresses created by thermal excursions. They must also permit separation (debonding) of the very delicate wafer from the rigid carrier, and leave no residue after debonding and cleaning.