WaferBOND® CR-200 Temporary bonding material

WaferBOND® CR-200 temporary bonding material enables back-end-of-line (BEOL) processing of ultrathin wafers with standard semiconductor equipment.

WaferBOND® CR-200 material enables:

  • Processing of ultrathin wafers using standard lithographic, passivation, and metallization techniques and tooling
  • Creation of interconnects before or after thinning
  • Preservation of delicate structures on III-V wafers through low-stress demounting
WaferBOND® CR-200 material is used for:
  • Wafer thinning
  • Thinned wafer processing
  • Interconnect formation
  • Low-stress demounting
WaferBOND® CR-200 properties:
  • Low-viscosity solution in solvent to provide planarization during spinning
  • Spin-applied coatings 10 to 27 µm thick
  • Thermal stability to 220ºC in bonded wafer pair state
  • Resistance to acids, bases, and most solvents
  • Transparent coatings under visible and infrared (IR) light for either optical or IR backside alignment