Temporary Bonding Systems

Brewer Science temporary wafer bonding systems allow for safe handling and transport of ultrathin wafers during rigorous backside processing steps.

Ultrathin wafer

Real solutions for ultrathin wafer handling

Our proven temporary wafer bonding systems are designed to fit into a variety of process scenarios with minimal disruption. We offer proprietary material and equipment sets for low-volume R&D environments, and we work with leading equipment vendors to provide fully automated solutions for higher-volume needs.

Work with the experts

Brewer Science was one of the first companies to recognize the potential of temporary wafer bonding for ultrathin wafer handling. Connect with one of our experts today to see how we can optimize your ultrathin wafer handling process.

Why ultrathin wafers?

Ultrathin wafers provide better heat dissipation, take up less space, and offer enhanced connectivity over conventional device wafers. By thinning device wafers after they have been processed, engineers can achieve the performance improvements and form factor reduction demanded by cutting-edge devices.

Why temporary bonding?

Ultrathin device wafers are extremely fragile and require a rigid support that allows the wafer to undergo further processing before it is diced and packaged. After surviving harsh processing conditions, the thin wafer must then be separated from the rigid support without resulting in damage.

Chemical Release System

  • Max Throughput 25 Wafers Per Cycle*
  • Thermal Stability Up to 220°C
  • Low Stress
Ideal for low-volume R&D production environments, the chemical release system involves bonding the device wafer to a perforated carrier for further processing. After processing is completed, the bonded pair is placed in a solvent bath for separation.

Contact us to learn more

*Wafers are separated using a batch process

Thermal Slide Release System

  • Max Throughput 15 WPH
  • Thermal Stability Up to 250°C
In the thermal release system, the device wafer is bonded to a standard carrier wafer and later separated via a high-temperature “slide” process. Both manual and automated equipment sets are available, making the thermal release system ideal for low- to mid-volume production environments.
BrewerBOND® 220

Contact us to learn more

Mechanical Release System

  • Max Throughput 20 WPH
  • Thermal Stability Up to 250°C
  • Low Stress
The mechanical release system offers low-stress separation suitable for both low- and mid-volume production environments. In this system, the bonding material is paired with a special release material on the carrier wafer, making it possible to gently “peel” the wafers apart during separation.

Contact us to learn more

Laser Release System

  • Max Throughput 40 WPH
  • Thermal Stability Up to 250°C
  • Low Stress
In the laser release system, the device wafer is bonded to a transparent glass carrier using a bonding material and a release material. Once processing is completed, the pair is separated by exposing the release material with an excimer laser. Low-stress separation coupled with high throughput make the laser release system suitable for all production environments.

Contact us to learn more