Temporary Bonding Systems
Brewer Science temporary wafer bonding systems allow for safe handling and transport of ultrathin wafers during rigorous backside processing steps.
Real solutions for ultrathin wafer handling
Our proven temporary wafer bonding systems are designed to fit into a variety of process scenarios with minimal disruption. We offer proprietary material and equipment sets for low-volume R&D environments, and we work with leading equipment vendors to provide fully automated solutions for higher-volume needs.
Work with the experts
Brewer Science was one of the first companies to recognize the potential of temporary wafer bonding for ultrathin wafer handling. Connect with one of our experts today to see how we can optimize your ultrathin wafer handling process.