WaferBOND® HT-10.10

Temporary Wafer Bonding Material

WaferBOND® HT-10.10 temporary bonding material enables back-end-of-line (BEOL) processing of ultrathin wafers with standard semiconductor equipment

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With WaferBOND® HT materials, you can:

  • Process ultrathin wafers in temperatures up to 220°C
  • Protect the wafer edge from chipping
  • Protect circuitry from harsh chemical etchants
  • Provide a void-free interface for a smooth surface on the final thinned wafer
  • Debonding with the WaferBOND®HT System
  • The WaferBOND® HT coating is mechanically debonded by heating the processed wafer until the carrier can be slid from the ultrathin wafer.

Thermal Debond

The WaferBOND® HT system supports high-throughput processes by enabling short debonding times. Debonding time is < 5 minutes.

  • Stripping Process for WaferBOND® HT Materials
  • Residue-free vias with Brewer Science® WaferBOND® Remover
  • Reduced defects compared to existing technology
  • Stripping Process for WaferBOND® HT Materials Stripping Process

Improve throughput of high-temperature ultrathin-wafer processing

Excellent void-free bonding and high-temperature stability delivered by the WaferBOND® HT product series increases yields and provides greater process latitude.

Additional benefits:

  • Excellent uniformity
  • Low defects
  • High throughput
  • Ability to be applied and removed with EVG® bonding and debonding equipment platform specifically designed to work with WaferBOND® HT materials.