WaferBond™ HT System

Enabling high-temperature processing and increased throughput of ultrathin wafers

WaferBOND™ HT materials influence the viability of ultrathin wafers by enabling:

High throughput
Process capability up to 220°C
Ultrathin wafer processing
Excellent uniformity

WaferBOND™ HT materials:

Protect the wafer edge from chipping
Protect circuitry from harsh chemical etchants
Provide a void-free interface for a smooth surface on the final thinned wafer

Added benefits include:

Low defects
High yield
Ability to be applied and removed with EVG^® bonding and debonding equipment platform specifically designed to work with WaferBOND™ HT materials.

Picture of full wafer (thinned to < 10 µm)

Debonding with the WaferBOND™ HT System

WaferBOND™ HT coating is mechanically debonded by heating the processed wafer until the carrier can be slid from the ultrathin wafer.

The WaferBOND™ HT system supports high throughput processes because of short debonding time. Debonding time is < 5 minutes.

Material design allows for rapid process throughput in debonding process.

Stripping Process for WaferBOND™ HT-250 Coating

• Residue-free vias with Brewer Science SafeStrip™ Stripper

• Reduced defects compared to existing technology

Via information: 0.7 µm wide and depth is 0.7 µm.

Improve throughput of high-temperature ultrathin-wafer processing

Excellent void-free bonding and high-temperature stability of the WaferBOND™ HT product series increases yields and provides greater process latitude.

For information about the EV Group^®bonding and debonding equipment platform, please visit the EVG^® website at www.EVGroup.com.

Customer Support

Brewer Science welcomes the opportunity to provide quality solutions for your specific application. Please contact us by email or call +573.364.0300 (US). Our support staff will promptly respond to your request.