WaferBOND® HT-10.10 Temporary bonding material

WaferBOND® HT-10.10 temporary bonding material enables back-end-of-line processing of ultrathin wafers with standard semiconductor equipment

With WaferBOND® HT materials, you can:
  • Process ultrathin wafers in temperatures up to 220°C
  • Protect the wafer edge from chipping
  • Protect circuitry from harsh chemical etchants
  • Provide a void-free interface for a smooth surface on the final thinned wafer
Debonding with the WaferBOND® HT System

The WaferBOND® HT coating is mechanically debonded by heating the processed wafer until the carrier can be slid from the ultrathin wafer.

The WaferBOND® HT system supports high-throughput processes by enabling short debonding times. Debonding time is < 5 minutes.

Stripping Process for WaferBOND® HT Materials
  • Residue-free vias with Brewer Science® WaferBOND® Remover
  • Reduced defects compared to existing technology

Stripping Process for WaferBOND<sup>®</sup> HT Materials Stripping Process
Vias: 0.7 µm wide, 0.7 µm deep

Improve throughput of high-temperature ultrathin-wafer processing

Excellent void-free bonding and high-temperature stability delivered by the WaferBOND® HT product series increases yields and provides greater process latitude.

Additional benefits:
  • Excellent uniformity
  • Low defects
  • High throughput
  • Ability to be applied and removed with EVG® bonding and debonding equipment platform specifically designed to work with WaferBOND® HT materials.