IWLPC - International Wafer-Level Packaging Conference

October 24-26, 2017

Wafer-level packaging conference image
October 24-26, 2017
San Jose, California
Double Tree by Hilton San Jose


SMTA and Chip Scale Review are pleased to announce the 14th Annual International Wafer-Level Packaging Conference and Tabletop Exhibition. IWLPC brings together some of the semiconductor industry’s most respected authorities addressing all aspects of wafer-level, 3D, TSV, and MEMS device packaging and manufacturing.

Schedule a time to meet at the conference or ask a question about a featured product:

For more information: Conference Website