The introduction of the BrewerBUILD™ material series offers an industry-wide multifunctional solution addressing the challenges associated with redistribution layer (RDL)-first/chip-last packaging in wafer- or panel-level processes.
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1. Temporary carrier coated with release layer
2. Seed layer deposition
3. Photoresist coat, patterning and electroplating
4. Photoresist strip, metal etch
5. Coat, pattern and cure polymide layer
6. Repeat steps 2 through 5 for creating muliple RDLs
7. Ball attach, die bonding, epoxy molding, mold grinding
8. Release carrier, clean release material from device
To avoid known-good die loss during packaging, an alternate fan-out process called RDL-first/chip-last fan-out packaging is used, where the RDL is first built on a carrier wafer, and KGD are placed on top of a known good RDL location thereby avoiding KGD loss. The RDL-first process also offers other advantages in terms of finer line/space dimensions for RDL to offer complex routing for denser device integration and a higher I/O count.
BrewerBUILD™ Material Series