Cee® Apogee™ Bonder/Debonder

Cee® Apogee™ Bonder

The Cee® Apogee™ bonder is fully programmable and user-friendly. It enables precision temporary bonding for a wide array of wafer sizes.

Cee® Apogee™ Debonder

The Cee® Apogee™ Mechanical Debonder makes it possible to debond wafers at room temperature under low stress, high precision conditions.