Cee® Apogee™ Bonder
The Cee® Apogee™ bonder is fully programmable and user-friendly. It enables precision temporary bonding for a wide array of wafer sizes.
Cee® Apogee™ Debonder
The Cee® Apogee™ Mechanical Debonder makes it possible to debond wafers at room temperature under low stress, high precision conditions.