Protecting our environment and conserving resources are essential to running a successful and mindful business, but how do you make this part of your organization’s mission and vision? The key to building a culture of environmental responsibility begins with the commitment and support of leadership and engagement of all employees. Engaged employees are a key source for ideas and serve on teams that assure regulatory compliance and build environmental projects. In this blog, we explore how Brewer Science has made environmental friendliness a part of everyday life for all employees through the following projects: Green Circle Zero Waste to Landfill certification, solvent reuse and Renewable Energy Certificates (RECs).
Richard Feynman, who won the Nobel Prize in Physics in 1965, gave a famous lecture titled “There's Plenty of Room at the Bottom.” Today’s microelectronics process engineer, in the context of conventional top down lithography, would find it difficult to accept this statement without a long list of caveats. Aggressive scaling demands for newer generations of microprocessors have led to extremely tight budgets for tolerances on device dimensions and device placement on a chip, among other challenges. One may argue that there is very “little room at the bottom” for error.
Much of the semiconductor industry is familiar with Brewer Science as the inventor and leader of the bottom anti-reflective coating (BARC) revolution. Since being established in 1981, Brewer Science has continued to be the market leader in supplying total solutions for enabling lithographic processes pushing beyond Moore’s Law. What many may not realize is that Brewer Science also pioneered the way with developmental materials and processes that enabled thin wafer handling (TWH) by providing temporary adhesives and release technologies.
The choice to be environmentally responsible began when the company was founded in 1981. The owner of Brewer Science, Dr. Terry Brewer, was focused on creating value for our customers through original technology products in the semiconductor market. As Brewer Science invented new products and technologies and manufactured them, Dr. Brewer continued to instill confidence and ‘followership’ that Brewer Science was the environmentally responsible technology leader that would continue to lead the world by inventing superior technology that would make the world a better place.
More than two months after hurricanes Irma and Harvey battered the Gulf of Mexico and the Caribbean, the U.S. continues to struggle with remediating the destruction.
Brewer Science has always had a reputation for innovative research. As a company, we have constantly pushed ourselves to not only work at the cutting edge of the industry but to push past that and address the future needs of the industry. As we continue to plan for the future needs of the lithography industry, we are constantly looking for new opportunities to build strong partnerships that will all us to produce the highest quality results for our customers.
The race to advance front-end lithography has seen previously insurmountable roadblocks become some for the industry’s greatest achievements. Brewer Science has been a market leader in advanced lithography breakthroughs starting with the invention of bottom anti-reflective coatings in 1981. Today, Brewer Science maintains a broad array of materials to meet the industry’s needs as we approach the limits of Moore’s Law and beyond. Spin-on-carbon (SOC) materials are part of this legacy of materials innovation.
In the not-too-distant future, we may routinely see smart food labels wrapped around meat packaging to digitally count down its expiration date. Perhaps a tiny device stuck to your car windshield will provide you a continual weather forecast, or a patch worn around your wrist will monitor your blood sugar levels in real time.
Follow Brewer Science’s four tips on how to focus and organize your plate:
Advanced packaging is moving mainstream as manufacturers continue to seek ways to improve device performance beyond traditional scaling. The semiconductor industry is also witnessing increasing investments in packaging, in terms of capabilities, capacity, and infrastructure from the assembly and packaging houses. All this attention on packaging is primarily driven by the need to deliver highly integrated, high-performance devices while addressing concerns for lower cost, lower power consumption, and reduction in form factor. From our perspective as a supplier of advanced packaging materials and a dominant player in the advanced packaging supply chain, we see a multitude of applications driving our growth in 2018 and beyond.