Brewer Science® ARC® anti-reflective coating technology has fundamentally and significantly enhanced the lithography process, which is key for enabling the manufacture of many generations of microelectronics devices. ARC® materials provide a unique pathway to extend photolithography equipment capabilities and save on capital investment, allowing its customers to break through the 1-µm feature barrier without the need for new tools.

The ARC® product line is designed to improve reflective notching and standing waves that are created by reflection from the substrate during the lithography step. Additionally, the enhanced optical control improves the cost of ownership while meeting the needs of ever-shrinking technology. Materials based on ARC® material technology have grown to become a standard in photolithography patterning, enhancing features and tool capabilities through every subsequent technology node.

The ARC® technologies have been expanded with materials and process systems for:

  • Immersion lithography
  • Double patterning
  • DBARC TechnologiesDeveloper-soluble bottom anti-reflective coatings

    Typical DBARC + photoresist profile

    Typical bottom anti-reflective coatings (BARCs) require a separate etch step to be removed after the photoresist has been developed. This can damage the substrate if the BARC open etch extends beyond the BARC. During this etch step, some of the remaining photoresist is also etched away. When the substrate is sensitive or the amount of photoresist that can be sacrificed during this step (etch budget) is limited, the ability to develop the BARC away with the photoresist becomes an attractive option. Using a developer-soluble BARC (DBARC) has many benefits, including:

    • Simultaneously develops with photoresist which eliminates impact of BARC plasma etch step
    • Substrate preservation
    • Increases tool uptime with low sublimation
    • Reduces CD variation versus TARC
    • Provides flexibility in resist selection

    Brewer Science® DBARC Products

    ARC® DS-A520 Photosensitive Developer-Soluble 193-nm BARC (ArF PS-DBARC)

    ARC® DS-A520 coating is a photosensitive developer-soluble bottom anti-reflective coating that is specially formulated to meet the needs of ArF photolithography and augments processes where the resist budget is limited. The use of a developer soluble BARC enables processes where underlying substrates may sustain damage from a reactive ion etch (RIE) and can also improve throughput in other applications by eliminating the BARC open RIE step which reduces the cost of ownership.

    ARC® DS-K101 Coating

    Brewer Science® ARC® DS-K101 is specially formulated to meet the needs of KrF photoligraphy for a BARC and to augment the effectiveness of the thin photoresist used in implant applications. The use of a developer-soluble BARC can improve throughput while reducing the cost of ownership of DUV processing. ARC® DS-K101 coating can be used in FEOL and BEOL applications where a traditional BARC is used such as:

    • Ion implant
    • High-k metal gates
    • Works with standard lithography processing tools.

    WiDE®-C Coating

    Brewer Science® WiDE®-C coating is specifically designed for wet patterning, which eliminates the need for a substrate adhesion promoter and separate BARC etch. The extended bake latitude and advanced optical characteristics allow the wet-patterning process to achieve 0.35- to 0.40-µm patterns. WiDE®-C is especially useful as a platform for a separation layer that serves as a lift-off application in devices such as surface acoustic wave guides (SAWs).

    WiDE®-30W Coating

    Brewer Science® WiDE® 30W anti-reflective coating is wet developable and therefore eliminates the need for a BARC etch step. All WiDE® anti-reflective coatings minimize CD variation by eliminating standing waves and reflective notching. This material can also be used for dry-etch systems with excellent results. WiDE® 30W anti-reflective coating has been successfully used as a sacrificial layer for lift-off applications.

    • Compatible with leading i-line resists
    • High absorbance allows less than 0.01-µm CD variations over 1800 Å of topography
    • Useful as a sacrificial layer in lift-off applications
    • Wet developable - no impact on etch tool or cycle time
    • PFOS free, for your health and the safety of the environment.
  • EUV lithography
  • EUV Assist Layers

    Brewer Science® EUV assist layers are designed to help improve the resolution and decrease the line edge roughness for EUV lithography - the newest generation of lithography tools.

    Brewer Science® E2Stack® AL412

  • OptiStack® system
  • OptiStack® Multilayer Systems


    Brewer Science® OptiStack® systems are industry proven lithography solutions designed to save you time and money and increase return on your lithography investment.

    Enabling the progression of Moore’s law beyond 20 nm, Brewer Science® OptiStack® systems are the leading choice for advanced lithography. These systems offer customized platforms for specific processing conditions. OptiStack® systems simplify the overall lithography process by offering a universal lithography platform that eliminates topography dispersion and maintains optimal optical interfaces in the same focal plane, regardless of the substrate optical properties.

    OptiStack® process flow graphic

    Simplify the overall lithography process

    OptiStack® systems simplify the overall lithography process by offering a universal lithography platform that eliminates topography dispersion and maintains optimal optical interfaces in the same focal plane, regardless of the substrate optical properties. This design helps simplify inventory management for our customers because it allows them to process multiple layers using a much narrower set of materials. This technology also helps customers by enabling them to broaden their design rules, increase their speed of design, and simplify their optical proximity correction (OPC) calculation because the same reflectivity is maintained on multiple layers.

    Extend resolution limits of existing tools

    OptiStack® systems allow customers to use thin resist technology, which will extend the resolution limits of their existing photolithography tool. While the expanded etch capability needed for multilayer processing may require an additional capital investment, this expense is minimal compared to upgrading to the next generation of scanners.


    • Support through modeling using OptiStack® simulation software
    • Proven technology to use with thin resists, which will extend the resolution limits of existing photolithography tool sets
    • Variable n and k with the OptiStack® HM800 series
    • Easy re-workability with the OptiStack® HM800 series
    • The ability to use the same material set for both KrF and ArF exposure
    • Improved BEOL throughput
    • Easy wet stripping from delicate substrates with the OptiStack® SOC300 series

    OptiStack® Stack Modeling Service

    Customizes BARC material for customer stack and reduce experimental time and cost with OptiStack® Stack Modeling Service

    General Questions & Comments

    Optistack® Simulation System

    Minimum reflectance does not guarantee optimal litho results when using high NA tools:

    OptiStack minimizes optical interference


    Learn more at Microlithography World Online

    Brewer Science® OptiStack® simulation tool is a service available exclusively through Brewer Science. We have developed this modeling system to quickly determine optimum ARC® product recommendations to match your substrate stack and topography, and to reduce time and money spent on material screening tests.

    With the new regime of hyper-NA exposure tools, optimizing solely for minimum reflectivity does not give the best resist profile and process window possible. The OptiStack® simulation tool can be used to examine the optical interference of the substrate reflection and predict processing conditions to compensate for chemical interactions using improved optical UV distribution at the foot of the resist.


These innovative systems enable IC manufacturers to achieve:

  • Significant yield improvements
  • Improved consistency wafer-to-wafer, and die-to-die
  • Lithography tool extension

Brewer Science® semiconductor technologies enhance processes such as:

  • Front End Of Line (FEOL)
  • Back End Of Line (BEOL)
  • Planarization
  • III-V Semiconductor