Bake Plates

Cee® Bake Plates

Bake plate processing has increased in popularity in the past few decades. Previously, the most common technique for film drying and curing was baking in a convection oven. Bake plates offer several advantages in the form of increased throughput, increased uniformity and reproducibility, and decreased particle contamination. In a typical baking process, the substrate is placed into contact with a heated surface of known temperature. The substrate quickly rises to a peak temperature slightly lower than the bake plate surface temperature. Drying and curing steps generally take 60-90 seconds to complete. In contrast, traditional oven processes taking 30 minutes or more. Uniformity of baking across the substrate with a well-designed bake plate is ensured because the substrate is placed in intimate contact with a surface of known constant temperature and thus heats at a consistent rate that is dependent only upon the bake style selected and the thermal conductivity of the substrate. Ultraprecise uniformities are attained through the combined effect of thermal conductivity and reflected radiant heat from the exhaust hood baffle.

Although temperature uniformity is the primary advantage for precision bake plates, they are also able to virtually eliminate skinning effects for thick-film applications. The skin effect is often observed when baking from the “outside in” and is a common issue related to conventional oven baking. With a precisely uniform baking process, the film is baked consistently from the bottom up, thus preventing the formation of the skin over the surface. Use of a bake plate makes it possible to increase temperatures and precisely adjust bake temperature ramp without blistering or cracking in the film. Brewer Science® Cee® bake plates also have the unique advantage of four separate bake methods that are available nowhere else on the market. These methods include programmable proximity lift pins, N2-gas proximity, soft contact, and hard contact bakes. These methods can be programmed to work in any sequence or combination for up to 9,999.9 seconds per step and up to 100 steps per bake recipe. These methods are essential in further refining and optimizing the baking process. For many baking processes, this feature allows for faster ramping and can be used to emulate several bake plate temperatures simultaneously. The Brewer Science® Cee® line of high-uniformity bake plates bring numerous capabilities in a compact footprint designed for a lab-scale environment.

Cee® 1300x Precision Bake Plate

Brewer Science® Cee® 1300X Precision Bake Plate

The Brewer Science® Cee® 1300X precision bake plate features a revolutionary intuitive interface, a space-saving design, and track-quality thermal accuracy and uniformity.

Fully programmable and user-friendly, the Brewer Science® Cee® 1300X precision bake plate features the accuracy and repeatability needed to eliminate processing variability from critical experiments. Recipes are easily entered, monitored, and stored with the convenient full-color touch screen interface, and onboard Windows®-based PC controller. Compact footprint, intuitive design, and unequaled experience add up to years of high-performance bake step processing, perfect for any low-volume or R&D laboratory processing environment.

Benefits

  • Onboard Windows®-based PC control for enhanced interface capabilities and connectivity
  • New compact design for minimized footprint
  • Full-color, 7-inch touch screen display
  • Durable wet-bench design that can be converted to a flange/deck mountable configuration
  • Enhanced logging and programmable height control

Dimensions

  • 13.25" W x 19" D x 12" H (33.65cm W x 48.26cm D x 30.48cm H)
  • Machine weight: 65 lb (29.48 kg)
  • Shipping weight: 148 lb (67.13 kg)

Programmability

  • Controlled by onboard Windows®-based PC
  • Touch screen interface and display
  • 250,000 bake process programs
  • Virtually unlimited steps per program
  • 0.1-s resolution for step times with a range of
  • 0 to 9,999.9 s/step
  • Three automated bake methods: contact, vacuum, proximity
  • Bake plate auto sizing for 3-in, 100-, 125-, 150-, and 200-mm  substrates
  • Temperature data recording
  • Ethernet port for network connectivity and uploading/downloading process parameters
  • Password protection available at no charge
  • Ramping capability optional (8 specific set points within single bake recipe)
  • Optional electronic lift pins (replace N2 proximity for loading/unloading substrates from bake module). Program 10 specific proximity heights above the surface in any sequence or combination. Height is programmed in 0.001" increments with an overall range of 0.000" to 0.500"
  • Energy-saving capability (for predetermined temperature output control)

Precision

  • Substrate sizes: < 1 cm to 200 mm round; 8" x 8" square)
  • Temperature resolution: 0.1° C
  • Temperature range: ambient to 300°C (400°C optional)
  • Temperature uniformity: ± 0.3% across working surface

Reliability

  • Exceptional reliability and up-time
  • 1-year full warranty parts and labor
  • Free technical (live) phone support for the life of the product
  • Application process assistance (live) for life of the product
  • Exhaust bake hood design
  • All stainless steel construction
  • Exhausted hood for removal of process chemicals
  • Optional nitrogen purge for inert bake environment

Utilities

  • Voltage ranges: 100, 110-125, 208-240 VAC
  • Power requirements: 1057, 1683, 1555 watts per plate
  • (16.7 amps)
  • Exhaust port: 1" OD
  • Vacuum: 20 to 25 in Hg
  • Exhaust: 5 to 10 cfm
  • N2 (for bake plate proximity): 35 psi
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Cee® 10Large-Area Bake Plate

Cee® 10 Bake Plate

The Brewer Science® Cee® 10 hot plate is designed for process and R&D engineers requiring a hot plate for substrate applications. The Cee 10 hot plate has capability for 300 mm or 14"³ square (maximum) substrates. This provides the user with repeatable thermal performance in a robust system design for years of reliable operation.

Programmability

  • Dual 4-digit alphanumeric LED display
  • Full PID operation
  • Temperature auto-tuning capable
  • Security: Password protection option at no charge
  • Ramping capability optional (8 specific set points)

Operation

  • Pneumatic Lift pin Option (Load/Unload) Standard
  • Removable Fixed Proximity Standoffs (.020" Standard)
  • Contact or Fixed Proximity Bake Method Standard
  • Vacuum and Proximity Bake for 200 and 300mm Wafers Optional
  • Optional Custom Hot Plate Surfaces Available Upon Request

Precision

  • Substrate sizes: 300 mm round, 14" x 14" square
  • Temperature resolution: 0.1°C
  • Temperature range: Ambient to 300°C (400°C optional)
  • Temperature uniformity: ± 0.3% across working surface

Exhaust Bake Hood Design (Optional)

  • All stainless steel construction
  • Exhaust hood for removal of process chemicals
  • Optional nitrogen purge for an inert bake environment

Dimensions

  • Machine weight: 77 lb (35 kg)
  • Shipping weight: 210 lb (95.5 kg)
  • Cabinet dimensions: 18.75" W x 18.75" D x 9.5" H (47.7 cm W x 47.7 cm D x 24.2 mm H)

Utilities

  • Power requirements: 208 to 240 volts A/C, 3005 to 4005 watts
  • Full load current: 14.4 to 16.7 amps
  • Input breaker/fuse: 20 amps
  • Optional exhausted lid port: 2" OD
  • Optional exhausted lid: 10 to 30 cfm range

Reliability

  • Exceptional reliability and up-time
  • 1-year full warranty parts and labor
  • Free technical phone support for the life of the product
  • Application process assistance for life of the product
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Cee® 11Large-Area Bake Plate

Cee® 11 Bake Plate

The Brewer Science® Cee® Model 11 bake plate is specifically designed for large area substrates, up to 450-mm round and 20-in square. It provides process and R&D engineers with the utmost in thermal accuracy and uniformity. The footprint is compact, so it installs seamlessly within existing clean room hoods or on laboratory table surfaces.

Operation

  • Pneumatic lift pin (load/unload) standard
  • Removable fixed proximity standoffs (0.006” standard)
  • Contact or fixed proximity bake methods (standard)
  • Optional vacuum and proximity bake for 300- and 450-mm
  • wafers
  • Optional custom bake plate surfaces available upon request

Programmability

  • Dual 4-digit alphanumeric LED display
  • Full PID operation
  • Temperature auto-tuning capable
  • Security: password protection option at no charge
  • Optional ramping capability (8 specific set points)

Precision

  • Maximum Substrate Sizes: < 1cm to 450-mm round; 20” × 20” square
  • Temperature Resolution: 0.1°C
  • Temperature Range: ambient to 200°C (250°C optional)
  • Temperature Uniformity: ± 0.3% across working surface

Dimensions

  • Machine Weight: 150 lb
  • Shipping Weight: 280 lb
  • Cabinet Dimensions: 24.938 in L × 24.938 in W × 9.5 in H

Reliability

  • Industry-leading reliability and uptime
  • 1-year full warranty on parts and labor
  • Free remote technical support (phone, email, fax) for the life of the product
  • Application process assistance for life of the product

Exhaust Bake Hood Design

  • All stainless steel construction
  • Optional exhausted hood for removal of process chemicals
  • Optional nitrogen purge for inert bake environment

Utilities

  • Power requirements: 208 to 240 volts AC, 2351-3130 watts
  • Full load current: 12.5 to 15.5 amps
  • Input breaker/fuse: 20 amps
  • Optional exhausted lid port: 2-inch OD
  • Optional exhausted lid: 10- to 30-cfm range
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