Brewer Science^® Products

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Protective Coatings
Temporary Bonding Solutions
Anti-Reflective Coatings
Multilayer Systems
Planarizing Materials
Carbon Nanotube Materials
Processing Equipment

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Bulk Micromachining
TSV Creation
Printed Electronics
Thin Wafer Handling
Surface Leveling
Lithography Extension
Implant Lithography
Process Control

ProTEK^® B3

Alkaline protective coating

ProTEK^® B3 thin films are spin-applied polymeric coating systems that provide temporary wet-etch protection for CMOS MEMS circuitry during alkaline etches. ProTEK^® B materials offer protection from alkaline solutions such as KOH and TMAH for extended bath etches.

ProTEK^® PSB

Photosensitive protective coating

ProTEK^® PSB coating is a photosensitive spin-on replacement for silicon nitride or silicon oxide wet-etch masks. When applied in combination with ProTEK^® B3 coating, it offers a full solution for alkaline wet etching. It can be applied after the CMOS circuitry is created and does not require mechanical clamps for protection.

ProTEK^® SR

Scratch-resistant coating

ProTEK^® SR coating is a spin-applied polymeric coating designed to provide maximum protection for fragile, etch-sensitive circuitry placed in direct contact against the interior chuck of the etch chamber. ProTEK^® SR coating offers durability and longevity against harsh backside DRIE processes typically utilized by the microelectromechanical systems (MEMS) and integrated circuit (IC) industries.

WaferBOND^® HT-10.10

Temporary bonding material

WaferBOND^® HT-10.10 temporary bonding material is a thermal-release bonding material used to mount thinned substrates onto a rigid carrier for structural support during processing. This material enables back-end-of-line processing of ultrathin wafers with standard semiconductor equipment.

WaferBOND^® CR-200

Temporary bonding material

WaferBOND^® CR-200 temporary bonding material is a solvent-release bonding material used to mount thinned substrates onto a rigid carrier for structural support during processing. This material enables back-end-of-line (BEOL) processing of ultrathin wafers with standard semiconductor equipment.

ZoneBOND^®

Thin wafer handling system

The ZoneBOND^® low-stress debonding process detaches the carrier wafer from the device wafer at room temperature using very low mechanical force for the separation. The technology utilizes two different zones for controlled adhesion of the device wafer to the carrier wafer.

ARC^® Products

Anti-reflective coatings

Brewer Science is the expert in manufacturing and implementing anti-reflective coatings for the semiconductor industry. Our line of ARC^® products spans the entire spectrum of lithography wavelengths and is the most comprehensive product line-up in the industry.

DBARC^® Products

Developer-soluble anti-reflective coatings

The use of a developer-soluble bottom anti-reflective coating (BARC) enables processes where underlying substrates otherwise may sustain damage from a reactive ion etching (RIE) and can improve throughput in other applications by eliminating the BARC open RIE step.

OptiStack^® System

For next-generation lithography

OptiStack^® systems offer a universal lithography platform that eliminates topography dispersion and maintains optimal optical interfaces in the same focal plane, regardless of the substrate optical properties.

EUV Assist Layers

For next-generation lithography

Brewer Science^® extreme unltraviolet (EUV) lithography assist layers are designed to help improve resolution and decrease line edge roughness for EUV lithography - the newest generation of lithography tools.

Level^® M10

Surface-leveling material

Level^® M10 self-leveling material provides a planar surface when coated over high-aspect-ratio structures. This spin-applied coating facilitates lithography over severe topography, provides a stable surface for application of resists and other thin films, and transfers the planar surface to underlying organic films by dry etching.

GF Series

Gap-fill materials

Brewer Science^® gap-fill systems are spin-on organics that are designed to planarize via and trench topography, minimizing the topography impact on lithography and etch process margins. Product introduction cycle-time is reduced by minimizing the impact of the device layout on the lithography process.

WGF Series

Wet gap-fill materials

Brewer Science^® wet gap-fill systems are spin-on organics that are designed to planarize via and trench topography, minimizing the topography's impact on lithography and etch process margins. Product introduction cycle time is reduced by minimizing the impact of the device layout on the lithography process.

CNTRENE^® C100LM

Carbon nanotube solution

Brewer Science^® CNTRENE^®C100LM carbon nanotube solution is designed for nonvolatile device production in harsh radiation applications.

Printed Electronics Materials

Brewer Science^® printed electronic materials are surfactant-free carbon nanotube (CNT) solutions designed for applications on plastic substrates requiring low-temperature processing. Materials for transparent conductive, conductive trace, sensors, and logic transistor applications are being developed for most film and patterning processes.

Processing Equipment

For labs and universities

Spin Coaters

Cee^® 200X

Precision spin coater

The Cee^® 200X precision spin coater delivers track-quality performance for photoresist, thin film, or other process chemical coating applications. With an easy-to-use interface and the utmost in chemical compatibility, all in an efficient, space-saving design, the Brewer Science^® Cee^® 200X is optimal for research, university, MEMs, and lab use.

Cee^® 300X

Heavy-duty-drive spin coater

The Brewer Science^® Cee^® 300X heavy-duty-drive spin coater combines an intuitive Windows^®-based operating system, extremely accurate spin speed control, and a high horsepower drive for aggressive acceleration. The 300X has a state-of-the-art user interface and has been designed specifically for 300-mm and larger LCD squares up to 14” × 14”.

Bake Plates

Cee^® 1300X

Precision bake plate

The Brewer Science^® Cee^® 1300X precision bake plate features the accuracy and repeatability needed to eliminate processing variability from critical experiments. Recipes are easily entered, monitored, and stored with the convenient onboard Windows^®-based PC controller. The 1300X is perfect for any low-volume or R&D laboratory processing environment.

Cee^® 10

Large area bake plate

The Brewer Science Cee® 10 hot plate is designed for process and R&D engineers requiring a hot plate for substrate applications. The Cee 10 hot plate has capability for 300-mm round or 14"³ square (maximum) substrates. This provides the user with repeatable thermal performance in a robust system design for years of reliable operation.

Cee^® 11

Large-area bake plate

The Brewer Science^® Cee^® Model 11 bake plate is specifically designed for large area substrates up to 450-mm round and 20-in square. It provides process and R&D engineers with the utmost in thermal accuracy and uniformity. The footprint is compact, so installation is seamless within existing clean room hoods or on laboratory table surfaces.

Developers

Cee^® 200XD

Spray/puddle developer

The Brewer Science^® Cee^® 200XD puddle and spray developer delivers track-quality performance, a revolutionary touch screen interface, and the utmost in chemical and process flexibility in an efficient, space-saving design.

Cee^® 300XD

Heavy-duty spray/puddle developer

The Brewer Science^® Cee^® 300XD spray/puddle developer combines an intuitive Windows^®-based operating system, a ProSys MegPie megasonic transducer, extremely accurate spin-speed control, and a high horsepower drive for aggressive acceleration. The 300XD has a state-of-the-art user interface and has been designed specifically for 300-mm round substrates and large LCD squares up to 14” × 14”.

Cee^® 300MXD

Megasonic developer/cleaner

The Cee^® 300MXD megasonic developer/cleaner combines an intuitive Windows^®-based operating system, megasonic transducer (ProSys MegPie), extremely accurate spin speed control, and a high-horsepower drive for aggressive acceleration. The radial megasonic array is specifically designed to apply uniform acoustic energy to spinning substrates.

Combination Tools

Cee^® 200CBX

Precision coat-bake system

The Brewer Science^® Cee^® 200CBX precision coat-bake system combines a track quality precision spin coater with a high-uniformity bake plate in an efficient, space-saving design.

Cee^® 200DBX

Precision develop-bake system

The Brewer Science^® Cee^® 200DBX precision develop-bake system combines a track-quality precision developer with a high-uniformity bake module (for post-exposure baking) in an efficient, space-saving design.

Cee^® Flange-Mount

Coat, bake, & develop modules

The Brewer Science^® Cee^® flange-mount spin coaters, developers, and bake plates provide all the industry-leading features of Cee^® X-series tools in a convenient deck-mountable design.

Wafer Debonders

Cee^® 1300DB

Thermal slide debonder

The Brewer Science^® Cee^® 1300DB semiautomatic debonder enables high-temperature slide-off debonding of thinned wafers in a laboratory setting. This tool facilitates small-scale prototyping capability may be used to accelerate product development cycles and improve time to market for new ultrathin wafer technologies.

Cee^® 1300CSX

Thermal slide debonder

The Brewer Science^® Cee^® 1300CSX benchtop debonder enables high-temperature slide-off debonding of thinned III-V and compound semiconductory (CS) materials in a laboratory setting. This tool facilitates small-scale prototyping that may be used to accelerate product development cycles and improve time to market for new CS applications (high-power RF, LED, and solar).

ZoneBOND^®

Separation tool

The Brewer Science^® ZoneBOND^® separation tool is designed for separating wafers that have been bonded using the ZoneBOND^® system for thin wafer processing. The ZoneBOND^® system enables use of materials that broaden the thermal budget while maintaining very-low-stress room temperature debonding.

Edge Protection

EdgeWRAP^®

Edge protection system

The Brewer Science^® EdgeWRAP^® system enables seamless coating of substrate edges by simultaneously applying material to the top, edge, and bottom side-rim of a substrate. By "wrapping" the edge of the wafer, device manufacturers can protect sensitive structures and the wafer edge so that excellent mechanical substrate stability can be maintained during chemical wafer thinning and deep cavity etching.

Mini-Environment Workstations

Cee^®X-Pro

Workstation

Brewer Science® Cee® X-PRO workstations offer customized exhaust enclosures that integrate with their stand-alone cabinets and create a virtual clean room environment (commonly known as a mini-environment).

Materials Foundry^SM

Custom formulations

The Brewer Science^® Materials Foundry is designed for customers to discover their own solutions and then collaborate with Brewer Science to optimize these solutions for production.

IP & Licensing

Brewer Science has always been driven to deliver value to our customers. To expand on this commitment, we are making part of our patent portfolio available for licensing.

Safety Datasheets

SDS

This site is updated on a regular basis with SDS documents for new products and changes to current products. For an SDS on a product that is not on this site or for information on the safety, handling, use, or disposal of any Brewer Science products.