ZoneBOND® Separation Tool

The Brewer Science® ZoneBOND® separation tool is designed for separating wafers that have been bonded using the ZoneBOND® system for thin wafer processing. The ZoneBOND® system enables use of materials that broaden the thermal budget while maintaining very-low-stress room temperature debonding. ZoneBOND

Benefits

  • Design that permits in-house debonding of fully processed proprietary ultrathin device wafers
  • Device wafer debonding on film frame
  • Onboard Windows®-based PC control for enhanced interface capabilities and connectivity
  • Compact design for minimized footprint
  • Full-color, 7-inch touch screen display
  • Enhanced force logging

Processed Wafer

Thinned wafer after being debonded with ZoneBOND™ separation tool
Thinned wafer after being debonded with
ZoneBOND® separation tool

Brewer Science® Thin-Wafer Handling Solutions

Brewer Science® solutions for thin wafer handling combines materials, processes and equipment:

Chemical Release Technology Slide Debonding Technology ZoneBOND® Technology (Beta Stage)
  • Room temperature debonding capability
  • Higher throughput capability
  • Compatible with 100- to 300-mm wafers

Download the ZoneBOND® Edge Preparation Tool data sheet

Video Demonstration

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