Spin Coaters

Cee® Spin Coaters

Brewer Science® Cee® precision spin coaters deliver track-quality performance, with revolutionary interface capabilities and chemical compatibility, in an efficient, space-saving design.

Brewer Science has established a reputation for being the supplier of choice for those seeking flexible and dependable wafer processing equipment solutions. Brewer Science® Cee® spin coaters have proven that it is possible to obtain million-dollar-track uniformity in a smaller, more flexible, much less expensive system. The < 0.2-rpm spin speed resolution/repeatability achieved with the Cee® spin coater are leading standards for the industry.

Brewer Science® Cee® spin coaters can be found in the clean rooms of top semiconductor companies, R&D facilities, and universities. These companies invest in Brewer Science® Cee® spin coaters because of the high uptime, after-sale support, flexibility and cost of ownership offered by Brewer Science® Cee® spin coating processing equipment.

LEARN MORE ABOUT SPIN COATING
SPIN COATING PROCESS THEORY

Introduction to Spin Coating

Spin coating has been used for several decades as a method for applying thin films. Several critical variables come into play when spin coating liquid materials, including photosensitive materials. Programmable spin speed, acceleration, repeatability, resolution, and fume exhaust control, have critical effects on the overall coating uniformity, thickness, surface quality, and device yield.

One of the most important factors in spin coating is repeatability. Subtle variations in any parameter of the spin process can result in drastic variations in the coated film quality. Other critical factors in spin coating include overall spin speed and the accuracy of this variable. The speed of the substrate affects the degree of centrifugal force applied to the liquid material as well as the velocity and characteristic turbulence of the air immediately above it. In particular, the high-speed spin step generally defines the final film thickness. Relatively minor variations in spin speed can cause severe coating anomalies. Therefore, spin speed accuracy can have tremendous effects on consistent thickness and downstream process success.     

Acceleration of the substrate toward the final spin-coating speed can also dramatically affect the coated film properties. Because the material begins to dry during the initial part of the spin cycle, it is important to accurately control acceleration. In many cases, up to 50% of the solvents in the resin will be lost to evaporation in the first few seconds. The ability to actually achieve ramp rates of ≥20,000 rpm/s with a fully loaded chuck and maintain accurate speeds (<0.2 rpm) during the entire process recipe can be important.

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Cee® 200X Precision Spin Coater

Cee® 200X precision spin coater

The Brewer Science ® Cee® 200X spin coater features a space-saving design, onboard PC controller, full-color touch screen interface, and virtually unlimited recipe storage.  By using a unique indirect drive system, Cee® spin coaters virtually eliminate risk associated with process chemicals and solvents contacting the spin motor and causing permanent damage.  This critical feature ensures industry-leading reliability and uptime for our customers.

The Cee® 200X spin coater configuration includes a lid that can also be exhausted and/or N2 purged for greater environmental control.  The Cee® 200X spin coater is capable of spin coating substrates up to 7” square or 200-mm round and features high torque for maximum ramping capability.  You can also spin coat smaller size substrates (<1-cm through 200-mm) using a wide array of spin-coating chuck sizes.  We offer three separate torque/speed options for accommodating specific loads.  

Programmability

  • PC-controlled
  • Touch screen interface and display
  • Full-color alphanumeric-capable graphical user interface
  • 250,000 process recipe programs on board
  • A virtually unlimited number of user-defined recipe program steps
  • 0.1-second resolution for step times (9,999.9 seconds maximum step time)
  • Spin speed: 0 to 6,000 rpm (12,000 rpm option at no charge; 16,000 rpm option available)
  • Spin speed acceleration:
  • 0 to 30,000 rpm/s unloaded
  • 0 to 23,000 rpm/s 200-mm substrate
  • 0 to 3,000 rpm/s 6" x 6" x 0.250" photomask recessed chuck
  • Connectivity: USB/ethernet port for communications for uploading/downloading coating process parameters with offline firmware standard (unlimited number of offline recipes and recipe steps)
  • System capable of controlling third-party host software for high-end IDI/Cybor/Mykrolis positive displacement pumps
  • Simultaneous dual automated dispense capability
  • Bidirectional speed control/oscillating chuck
  • Iteration software (recipe looping)
  • Dispense or component outputs: 50
  • Security: Password protection option available at no charge
  • In-process/dynamic speed/acceleration control

Precision

  • Spin speed repeatability: < 0.2 rpm
  • Spin speed resolution: < 0.2 rpm
  • Substrate sizes: < 1 cm to 200 mm round; 7"x7" square

Reliability

  • Indirect drive system protects the spin motor from contact with process chemicals and solvents
  • Vacuum and lid interlock
  • Industry-leading reliability and uptime
  • 1-year full warranty on parts and labor
  • Free remote technical support (phone, email, fax) for the life of the product
  • Application process assistance for life of the product

Bowl Design

  • Teflon® spin bowl for expanded material compatibility
  • Integrated bowl ring to eliminate material migration
  • Optional stainless steel bowl (for all-stainless-steel construction)
  • Optional polyethylene bowl (educational package) available
  • Optional polyethylene liners available
  • Optional polyethylene/Teflon® splash ring
  • Closed and optional open lid designs for process flexibility
  • Drain and exhaust ports located in the bottom of bowl
  • Optional nitrogen purge for an inert spin environment

Dimensions

  • 13.25" W x 19" D x 12" H (33.65 cm W x 48.26 cm D x 30.48 cm H)
  • Machine weight: 40 lb (18.14 kg)
  • Shipping weight: 100 lb (45.36 kg)

Utilities

  • Voltage ranges: 100, 110-125, 208-240 VAC, 50/60 Hz
  • Power requirements: 655 Watts
  • Drain port: 0.75" OD
  • Exhaust port: 1" OD
  • Vacuum: 20 to 25" Hg
  • Exhaust: 20 to 50 cfm at 0.2" water
  • Nitrogen or CDA (for automated dispense): 70 psi
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Cee® 300X Heavy-Duty-Drive Spin Coater

Cee<sup>®</sup> 300X heavy-duty-drive spin coater shown with X-Pro package

Shown with optional X-Pro configuration

The Brewer Science® Cee® 300X heavy-duty-drive spin coater combines an intuitive Windows®-based operating system, extremely accurate spin speed control, and a high horsepower drive for aggressive acceleration. These features combine to ensure the elimination of process variables for a large array of process chemicals and applications. The 300X has a state-of-the-art user interface and has been designed specifically for 300-mm and larger LCD squares up to 14” × 14”.

Benefits

  • Onboard Windows®-based PC control for enhanced interface capabilities and connectivity
  • Enhanced Lid-lift assist feature (gas spring opens ≥45°)
  • Stand alone cabinet and streamlined design for minimized footprint (Chemical Storage)
  • X-PRO Workstation integrates stand alone cabinet with an upper exhaust enclosure for creating mini-environment (monitors and data logs ambient conditions)
  • New compact design for minimized footprint
  • Full-color, 7-inch touch screen display
  • Drive system (indirect) with highest horsepower in its class

Programmability

  • PC-controlled
  • Touch screen interface and display
  • 250,000 process recipe programs on board
  • A virtually unlimited number of user-defined recipe program steps
  • 0.1-second resolution for step times (9,999.9 seconds maximum step time)
  • Spin speed: 0 to 6,000 rpm (4000 rpm and 3000 rpm option available for additional acceleration capabilities)
  • Spin speed acceleration:
    0 to 30,000 rpm/s unloaded
    0 to 23,000 rpm/s 300-mm substrate
    0 to 3,000 rpm/s 350-mm × 6-mm round recessed spin chuck
    0 to 400 rpm/s 14-in × 14-in × 1.1-mm in photomask recessed chuck
  • Connectivity: USB/ethernet port for communications for uploading/downloading process parameters with offline firmware (offline recipe number and steps unlimited)
  • System capable of controlling third-party host software for high-end IDI/Cybor/Mykrolis positivie displacement pumps
  • Capabilities to simultaneously-trigger multiple (up to 16) automated dispense nozzles
  • Bidirectional speed control/oscillating chuck
  • Iteration software (recipe looping)
  • Dispense or component outputs: 50
  • Security: Password protection option available at no charge
  • In-process dynamic speed acceleration control

Precision

  • Spin speed repeatability: < 0.2 rpm
  • Spin speed resolution: < 0.2 rpm
  • Substrate sizes < 1 cm to 450 mm round; 14 in × 14 in square

Reliability

  • Indirect drive system protects the spin motor from contact with process chemicals and solvents
  • Vacuum and lid interlock
  • Industry-leading reliability and uptime
  • 1-year full warranty on parts and labor
  • Free remote technical support (phone, email, fax) for the life of the product
  • Application process assistance for life of the product

Bowl and Exhaust Hood Design

  • All stainless steel construction
  • Optional ETFE-coated spin bowl for material compatibility
  • Optional Teflon®/polyethylene bowl (non-disposable bowl liner)
  • Optional closed and open lid design for process flexibility
  • Optional Teflon®/polyethylene splash ring
  • Drain and exhaust ports located in the bottom of bowl
  • Optional nitrogen purge for an insert spin environment

Dimensions

  • Machine weight: ~115 lb (52.2 kg)
  • Shipping weight: ~250 lb (113.4 kg)
  • Cabinet dimensions: 27.75 in (70.5 cm) W × 34.75 in
    (88.3 cm) L × 20.25 in (51.5 cm) H

Utilities

  • Power requirements: 200-240 VAC, 1350 watts, 7.0 amp
  • Drain port: 1 in OD
  • Exhaust Port: 1.5 in OD
  • Vacuum: 20-25 in hg
  • Exhaust: 20-50 cfm at 0.2 in water
  • Nitrogen or CDA (for automated dispense): 70 psi
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Thin-wafer handling: Spin chuck designs for thinned substrates

Several spin-coating process applications require the ability to uniformly coat, develop, and/or rinse (clean) thinned and fragile substrates. Safely handling these fragile materials is paramount and requires specially designed spin chucks and thin-wafer handling techniques.

Read more about Thin-wafer handling: Spin chuck designs for thinned substrates

Other Blogs:
Overcoming spin-coating challenges for square substrates