WaferBOND^® HT-10.10 temporary bonding material enables back end of line processing of ultrathin wafers with standard semiconductor equipment

Brewer Science^® WaferBOND^® HT materials influence the viability of ultrathin wafers by enabling:

• High throughput
• Process capability up to 220°C
• Ultrathin wafer processing
• Excellent uniformity

WaferBOND^® HT materials:

• Protect the wafer edge from chipping
• Protect circuitry from harsh chemical etchants
• Provide a void-free interface for a smooth surface on the final thinned wafer

Added benefits include:

• Low defects
• High yield
• Ability to be applied  and removed with EVG^® bonding and debonding equipment platform specifically designed to work with WaferBOND^® HT materials.

 

Picture of full wafer (thinned to < 100 µm)

Debonding with the WaferBOND^® HT System

WaferBOND^® HT coating is mechanically debonded by heating the processed wafer until the carrier can be slid from the ultrathin wafer.

The WaferBOND^® HT system supports high throughput processes because of short debonding time. Debonding time is < 5 minutes.

Material design allows for rapid process throughput in debonding process.

Stripping Process for WaferBOND^® HT Materials

• Residue-free vias with Brewer Science^® WaferBOND^® Remover

• Reduced defects compared to existing technology

Via information: 0.7 µm wide and depth is 0.7 µm.

Improve throughput of high-temperature ultrathin-wafer processing

Excellent void-free bonding and high-temperature stability of the WaferBOND^® HT product series increases yields and provides greater process latitude.

For information about the EV Group^® bonding and debonding equipment platform, please visit the EVG^® website at www.EVGroup.com.