Wax Materials vs Brewer Science Thermal Slide Technology

The New Standard in Thermal Slide Technology

Lower cost of ownership through increased throughput, decreased rework, wider process capabilities, and maximized device yield
Improved via uniformity and increased die yield across substrate
Rheology designed for maximum device support during extreme thermal backside processing
Ability to safely handle thinned device wafers through debonding and cleaning

Wax Replacement Slide