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Environment
Site Map
2:
Markets
2.1:
Semiconductor
2.3:
MEMS, Sensors & Displays
2.3.1:
Micromachining
2.3.2:
Surface Energy Modification
2.3.3:
Leveling Extreme Topography
2.3.4:
Thin Wafer Handling
2.3.5:
MEMS FAQs
2.4:
Advanced Packaging
2.4.1:
Thin Wafer Handling
2.4.1.1:
ZoneBOND™ Process
2.4.1.2:
Chemical Debonding
2.4.1.3:
Thermal Slide Debonding
2.4.2:
Planarization - Trench Fill
2.4.3:
Surface Protection
2.4.5:
Micromachining
2.4.6:
Advanced Packaging FAQs
2.5:
LED & Energy
2.5.1:
Light Extraction
2.5.2:
Wet Etch Protection
2.5.3:
Physical Protection
2.5.4:
Metal Deposition & Alternatives
2.5.5:
Thin Wafer Handling
2.5.6:
LED FAQs
2.6:
Semiconductor Equipment
2.7:
Compound Semiconductor
4:
Products
4.1:
Anti-Reflective Coatings
4.1.1:
Dry Etch ARC® Coatings
4.1.1.1:
193-nm (ArF) Products
4.1.1.2:
248-nm (KrF) Products
4.1.1.3:
365-nm (i-Line) Products
4.1.1.3.1:
ARC i-CON Coating
4.1.1.3.2:
XHRiC Coating
4.1.1.3.3:
WiDE®-Series Coating
4.1.1.3.4:
GenARC® 365 Coating
4.1.2:
Developer-Soluble BARC
4.1.7:
PFOS-Free Program
4.1.8:
FAQs
4.2:
OptiStack® Systems
4.2.1:
OptiStack® Simulation
4.2.2:
OptiStack® Customer Advantages
4.3:
Lift-Off Materials
4.4:
EUV Assist Layers
4.5:
Gap-Fill Systems
4.6:
Protective Coatings
4.6.1:
Lift-Off Materials
4.6.2:
ProTEK® SR Coating
4.6.3:
ProTEK® B3 Coatings
4.6.4:
ProTEK® PSB Coating
4.6.5:
EdgeWRAP® System
4.6.6:
FAQs
4.9:
Temporary Bonding
4.9.1:
ZoneBOND™ Process
4.9.2:
WaferBOND® CR-200
4.9.3:
WaferBOND® HT-10.10
4.10:
Processing Equipment
4.10.1:
Spin Coaters
4.10.1.1:
Spin Coater (200X)
4.10.1.3:
Heavy-Duty-Drive Spin Coater (300X)
4.10.2:
Bake Plates
4.10.2.1:
Bake Plate (1300X)
4.10.2.2:
300-mm Bake Plate (10)
4.10.2.3:
450-mm Bake Plate (11)
4.10.3:
Developers
4.10.3.1:
Developer (200XD)
4.10.3.2:
Developer (300XD)
4.10.3.3:
Megasonic Developer / Cleaner (300MXD)
4.10.4:
Combination Tools
4.10.4.1:
Develop-Bake System (200DBX)
4.10.4.2:
Coat-Bake System (200CBX)
4.10.5:
Flange Mount Systems
4.10.6:
Wafer Debonders
4.10.6.1:
Slide Debonder (1300DB)
4.10.6.2:
ZoneBOND™ Separation Tool
4.10.6.3:
Slide Debonder (1300CSX)
4.10.7:
EdgeWRAP® System
4.10.10:
Automated Bottle Filling System
4.10.11:
Processing Theory
4.10.14:
Equipment FAQs
4.10.16:
Testimonials
4.12:
High-Refractive Index
4.15:
Planarization Solutions
4.16:
Etch Protection Solutions
4.17:
Ancillary Materials
4.18:
Carbon Nanotube Solutions
4.19:
Materials Foundry
4.20:
FAQs
4.20.1:
Advanced Packaging FAQs
4.20.2:
Lithography FAQs
4.20.3:
MEMS FAQs
4.20.4:
Equipment FAQs
4.20.5:
LED FAQs
6:
Research
6.1:
Publications
6.2:
Patents
6.3:
Processing Theory
6.3.1:
Bake Plate Overview
6.3.2:
Bake Plate Process Theory
6.3.3:
Spin Coater Theory
6.3.4:
Processing Equipment
8:
Company
8.3:
Vision
8.7:
Global Operations
8.7.1:
North America
8.7.2:
Asia
8.7.3:
Europe
8.8:
Quality
8.8.1:
Customer Satisfaction
8.8.2:
Customer Quality Report Portal
8.8.3:
Registrations
8.11:
Testimonials
8.13:
Media
9:
Contact Us
9.4:
Global Operations
27:
Blog
Find us on:
Brewer Science News
May 2, 2012
Brewer Science Presents Peaceful Bend Wine Cellar Concert Featuring The Internationally Acclaimed Jacques Thibaud String Trio
Apr 17, 2012
Brewer Science introduces thin wafer handling systems for compound semiconductor device processing
Apr 16, 2012
Dr. Brewer Speaks About Innovation
Brewer Science Upcoming Events
The ConFab
May 11, 2012 to May 11, 2013
Brewer Science Blog
Background of multilayer processing
Solvent vapor control for optimal thick-film spin coating
Etch protection questions and answers
Photosensitive etch mask for creating through-silicon vias (TSVs)
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