Advanced Packaging

The future of semiconductor manufacturing

Advanced packaging may be the last step in semiconductor device fabrication, but it's the start of the next generation of semiconductor device manufacturing.

Advanced Packaging Material Solutions:

Find the material that best fits your needs
= Selected
= Debond Method
= Benefits
= Maximum Process Temperature
= Additional Options
= Backside Process
= Not Available
Carrier Rework
FOWLP
PGMEA Resistant
High-Vacuum CVD/PVD
CVD/PVD
Grind to 30μm
Grind to 50μm
Grind to 100μm
< 200°C
200-250°C
250-300°C
> 300°C
Laser
Chemical
Release
Thermal
Slide
Mechanical

Click on the wheel to display Brewer Science products

  • Click on a debond method
  • Click on a thermal stability
  • Click on a backside process

Brewer Science + Advanced Packaging

Brewer Science has been using its materials expertise in the semiconductor industry to change the way the world looks at advanced packaging for over 10 years. With collaboration from our research & development and applications groups we have become one of one of the largest advanced packaging knowledge centers in the world; creating the largest portfolio of products in the industry.

Click on the wheel to display Brewer Science products

  • Click on a debond method
  • Click on a thermal stability
  • Click on a backside process

More than Moore

Moore's Law over the last couple years has proven to see its limititations for doubling its transistors every 18 months. Brewer Science's advanced packaging division is proving its spot in the More-than-Moore Technology (MtM) areas. With its ability to enable better performance while reducing space without having to scale quite as much.

BENEFITS OF MtM

  • Quicker time to market
  • Lower cost
  • Improved performance
  • Reduced size and space
  • More flexibility

Partnerships Leading to Better Advanced Materials

Brewer Science's ability to partner with equipment manufacturers as well as the chipmakers gives us the advantage moving forward. Our ability to work hand in hand on understanding the needs and capabilities of the equipment allows us to troubleshoot material needs at a quicker rate than ever before. Our culture of thinking outside the box and collaborating has proven that we are a company that can fulfill any potential customers needs.