Three-dimensional (3-D) integration and packaging of devices is being driven by the need for:

• Reduced size and weight
• Higher functionality
• Higher power efficiency

The various ways being pursued to achieve these 3-D structures have one thing in common, thinned silicon.

Thinned silicon wafers are fragile and require a temporary rigid support that allows the wafer to be successfully processed further for stacking. When finished, the thin processed wafer must be separated from the rigid support using a simple, cost-effective process, without resulting in damage.

The bonding materials used to attach the device wafer to the rigid support, or carrier, must meet very stringent requirements. They must survive extreme temperatures, harsh corrosive and solvent chemistries, and mechanical stresses created by thermal excursions. They must permit separation (debonding) of the very delicate wafer from the rigid carrier, and leave no residue after debonding and cleaning.

Brewer Science offers multiple temporary bonding technology options with corresponding processes and bonding materials:

Chemical debonding processes
Thermal slide debonding processes
ZoneBOND™ low-stress debonding process