BrewerBOND® T1100/C1300 Series Materials

TWH solution for high-temperature and high-stress applications

BrewerBOND® T1100/C1300 Series Materials enable our unique Dual-Layer solution for high-temperature and high-stress applications found within the semiconductor industry.

BrewerBOND® T1100/C1300 Series Materials

BrewerBOND® T1100/C1300 Material Series Benefits

  • Dual-Layer system with high-Tg thermoplastic and curable material
  • Mechanical stability, no movement of bonding material, and thermal stability ≤ 400°C
  • Low-temperature bonding (25°C to ≤ 100°C)
  • Increased throughput
  • Increased adhesion at all interfaces
  • Post-bond TTV ≤ 5% of the nominal bond-line thickness
  • Reduced baking & cleaning times
  • Compatible with mechanical or laser debonding

BrewerBOND® T1100/C1300 Series Materials enable our unique Dual-Layer solution for high-temperature and high-stress applications found within the semiconductor industry.

Markets for Dual-Layer Solutions

  • 3DIC
  • Power
  • MEMS
  • FOWLP
  • III-V

BrewerBOND® T1100 Series Materials are a thermoplastic platform applied to the device as a conformal adhesive coating.

BrewerBOND® C1300 Series Materials are a curable layer that, applied to the carrier, provides high melt flow, low temperature, and low-pressure bonding with no melt flow post-curing.

Together, these two layers enable mechanical stability with no movement and provide in-process thermal stability ≤ 400°C.