BrewerBOND® T1100/C1300 Series Materials

TWH solution for high-temperature and high-stress applications
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BrewerBOND® T1100/C1300 series materials enable our unique VersaLayerTM system for high-temperature and high-stress applications found within the semiconductor industry.

BrewerBOND® T1100/C1300 Series Material Benefits

  • VersaLayerTM system with high-Tg thermoplastic and curable material
  • Mechanical stability, no movement of bonding material, and thermal stability ≤ 400°C
  • Low-temperature bonding (≤ 25°C)
  • Increased throughput
  • Increased adhesion at all interfaces
  • Post-bond TTV ≤ 5% of the nominal bond-line thickness
  • Reduced baking time
  • Compatible with mechanical or laser debonding
Gen4

BrewerBOND® VersaLayerTM Bonding System Typical Process Flow

VersaLayer Process Flow

BrewerBOND® T1100/C1300 series materials enable our unique VersaLayerTM system for high-temperature and high-stress applications found within the semiconductor industry.

Markets for VersaLayerTM Solutions

BrewerBOND® T1100 series materials are a thermoplastic platform applied to the device as a conformal adhesive coating.

BrewerBOND® C1300 series materials are a curable layer applied to the carrier that provides high-flow, low-temperature, and low-pressure bonding with no melt flow post-cure.

Together, these two layers enable mechanical stability with no movement and provide in-process thermal stability ≤ 400°C.

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BrewerBOND® T1100/C1300 Series Materials

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