Wafer-Level Packaging Category
The introduction of BrewerBUILD™ Material offers an industry wide multifunctional solution addressing the challenges associated with redistribution layer (RDL)-first/Chip-last packaging in wafer- or p
BrewerBOND® T1100/C1300 Series Materials enable our unique Dual-Layer solution for high-temperature and high-stress applications found within the semiconductor industry.
BrewerBOND® 530 mechanical debonding release material offers additional choices for stronger adhesions necessary for high stress/high temperature temporary bonding applications.
BrewerBOND® 220 temporary wafer bonding material is an organic coating that enables back-end-of-line (BEOL) processing of ultrathin wafers using standard semiconductor equipment.
Temporary wafer bonding release material for mechanical debonding applications
This UV laser release material was designed to benefit a variety of temporary bonding, debonding market applications including chip-first/chip-last and RDL-first FOWLP processes.
WaferBOND® HT-10.10 temporary bonding material enables back-end-of-line (BEOL) processing of ultrathin wafers with standard semiconductor equipment
WaferBOND® CR-200 temporary bonding material enables back-end- of-line processing of ultrathin wafers with standard semiconductor equipment
BrewerBOND® 305 temporary wafer bonding material is an organic coating that enables back-end-of-line (BEOL) processing of ultrathin wafers using standard semiconductor equipment.