BrewerBOND® 305 material is an organic temporary bonding material that improves throughput, simplifies cleaning, and shortens processing time. The material is stable in back-end-of-line processing up to 300°C (depending on downstream process specifications). Debonding is efficient and can be done in two ways. The first method is laser debonding with no force. The second method is mechanical debonding at room temperature with low force. This debonding versatility makes BrewerBOND® 305 material a great option for many different wafer-processing needs.
Key Market Sectors
- 3-D wafer-level packaging • MEMS
- Compound semiconductor
Benefits
- Enables backside temperature processing at 250°C - 300°C
- Enables mechanical or laser debonding with low force
- Maximizes wafer yield with optimized temporary wafer bonding with mechanical or laser debonding process
- Post-bond TTV < 2 μm
- Reduced cleaning chemical consumption and time