BrewerBOND® 305

Bonding Material for Mechanical and Laser Release

​BrewerBOND® 305 temporary wafer bonding material is an organic coating that enables back-end-of-line (BEOL) processing of ultrathin wafers using standard semiconductor equip- ment. This product improves throughput, simplifies cleaning, and shortens processing time.

Laser Release

Key Market Sectors

  • 3-D wafer-level packaging
  • MEMS
  • Compound semiconductor

BrewerBOND® 305 material is an organic temporary bonding material that improves throughput, simplifies cleaning, and shortens processing time. The material is stable in back-end-of-line processing up to 300°C (depending on downstream process specifications). Debonding is efficient and can be done in two ways. The first method is laser debonding with no force. The second method is mechanical debonding at room temperature with low force. This debonding versatility makes BrewerBOND® 305 material a great option for many different wafer-processing needs.

Benefits

  • Enables backside temperature processing at 250°C - 300°C
  • Enables mechanical or laser debonding with low force
  • Maximizes wafer yield with optimized temporary wafer bonding with mechanical or laser debonding process
  • Post-bond TTV < 2 μm
  • Reduced cleaning chemical consumption and time