Brewer Science® planarization solutions level the surfaces of processed wafers so that subsequent conventional photolithography processes can be used.
- Improve photoresist coverage over large 3-D topography
- Increase design latitude in manufacturing microelectronic devices
- Enable the creation of high-aspect-ratio structures earlier in the device manufacturing process
Fabrication of many microelectronic devices now involves the creation of high-aspect-ratio structures having large height or depth to narrow width ratios, such as trenches, vias, columns, and mesas. These structures provide isolation; serve as conduits for electrical, optical, or fluid signals; or enable pre-dicing before die singulation. Manufacturers require materials that can level the surface of these processed wafers so that subsequent conventional photolithography processes can be used.
Brewer Science® planarization solutions are spin-applied materials that are compatible with existing lithography processes and photoresists, allow processing over extreme topography, and are easily removed. These materials will expand engineering design capabilities, increase a device’s value, and minimize production costs.
Extreme Trench Filling
Trench dimensions: 400 µm deep × 1 mm wide
Via dimensions: 22 µm deep × 1 µm wide
Coated and baked wafer
Post-develop etch back wafer
Trench dimensions: 200 µm deep × 20 µm wide
200 µm × 20 µm trenches
200 µm × 20 µm trenches permanently filled with planarizing material