Permanent Bonding Materials

PermaSOL^™ Materials

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PermaSOL^™ Materials

PermaSOL™ Materials address a range of needs identified for permanent bonding applications, which include low-temperature bonding, excellent chemical resistance, thermally curable bonding process and no material movement after the bonding process.

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Advantages of Permanent Materials:

Adhesive for permanent applications
Target thickness range 1-20 µm
Low dielectric constant
High chemical resistance
High adhesion to various substrates
Room-temperature bonding
No squeeze out or material movement after cure
Thermally cured system

Key Market Drivers that Permanent Bonding Enhances:

MEMS devices including glass frit and anodic bonding technologies in order to achieve good hermeticity to protect the MEMS sensor
LED devices requiring metal bonding (eutectic and thermo-compression bonding) to meet higher performance in terms of light extraction
CMOS Image Sensors for direct bonding & adhesive bonding
SOI substrate manufacturing supporting the fusion bonding technology
3D Integration utilizing thermo-compression bonding (TCB)

Process Flow

permasol process flow

What are Permanent Bonding Materials?

Permanent bonding materials are adhesives used to assemble IC logic chips, memory chips, image sensor devices, and microelectromechanical systems (MEMS) devices that go into high-density heterogeneously integrated packages. These high-density, ultra-thin electronic packages are needed for artificial intelligence (AI) in high-performance computers, data centers, 5G, and high-end mobile products.

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Permanent Bonding Materials

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