Experience the difference with Brewer Science's revolutionizing technologies. We offer an extensive range of products, from lithography materials to equipment, that impact our everyday lives.
Directed self-assembly (DSA) is an exciting new technology that uses specially designed block copolymers to form IC patterns on a molecular scale.
BrewerBOND® 220 temporary wafer bonding material is an organic coating that enables back-end-of-line (BEOL) processing of ultrathin wafers using standard semiconductor equipment.
The Cee® ApogeeTM precision spin coater delivers track-quality performance with revolutionary interface capabilities.
The Cee® Apogee™ bake plate features a revolutionary intuitive interface, a space-saving design, and track-quality thermal accuracy and uniformity.
Now you can have all the amenities of a controlled clean room environment at your fingertips wherever you need it. We have created the ultimate stand-alone, completely customizable system that will change the way you work.
OptiStack® multilayer systems are our flagship lithography technology, and are used for leading-edge high volume IC manufacturing.
The Cee® 200DBX precision develop-bake system combines a track-quality precision developer with a high-uniformity bake module (for post-exposure baking) in an efficient space saving design.
ProTEK® PSB coating is a spin-on replacement for silicon nitride or silicon oxide wet etch masks
ProTEK® B3 coatings thin films are spin-applied polymeric coating systems that provide temporary wet-etch protection for CMOS MEMS circuitry during alkaline or acid etches.
ARC® anti-reflective coatings are the industry benchmark for reflection control and light absorption during photolithography.
Temporary wafer bonding release material for mechanical debonding applications
BrewerBOND® 701 material is suitable for all production environments due to its high throughput and no-stress separation.
WaferBOND® HT-10.10 temporary bonding material enables back-end-of-line (BEOL) processing of ultrathin wafers with standard semiconductor equipment
WaferBOND® CR-200 temporary bonding material enables back-end- of-line processing of ultrathin wafers with standard semiconductor equipment
BrewerBOND® 305 temporary wafer bonding material is an organic coating that enables back-end-of-line (BEOL) processing of ultrathin wafers using standard semiconductor equipment.
InFlect™ flex sensors utilize our revolutionary carbon-based nanotechnology to deliver a highly sensitive and real-time response to varying angles of deflection.
With its revolutionary carbon-based sensor design, our InFlect™ moisture sensor enables detection of small changes in relative humidity at millisecond speeds. These sensors are ideal for low-humidity
InFlect™ thermistors are among the fastest on the market, are highly accurate, and can operate at extremely low power, due to a revolutionary carbon-based nanotechnology.
The Cee® Model 11 bake plate provides the user with the utmost in thermal accuracy and uniformity.
The Cee® Model 10 bake plate provides the user with repeatable thermal performance in a robust system design for years of reliable operation.
The Cee® 200XD puddle and spray developer delivers track-quality performance, and chemical and process flexibility, in a space saving design.
The Cee® 300X heavy-duty-drive spin coater combines an intuitive Windows®-based operating system, accurate spin speed control, and a high horsepower drive.
The Cee® 300MXD megasonic developer & cleaning system applies uniform acoustic energy to spinning substrates to resolve high-density features.
The Cee® 300XD spray/puddle developer combines accurate spin speed control, and a high horsepower drive for aggressive acceleration.