Temporary Bonding Materials

Bonding and Debonding Product Portfolio

Creating Safe Handling and Flawless Outcomes

Brewer Science Bonding Material Portfolio

Technology	Temporary Bonding Material	Compatible Release Layer Material	Thermal Budget
Slide OR Mechanical Debonding	BrewerBOND^® 305	BrewerBOND^® 510	300°C
Excimer Laser Debonding	BrewerBOND^® 305	BrewerBOND^® 701	300°C
Slide OR Mechanical Debonding	WaferBOND® HT-10.11 and HT-10.12 Materials	BrewerBOND^® 510	250°C
Slide OR Mechanical Debonding	WaferBOND® HT-10.11 and HT-10.12 Materials	BrewerBOND^®510	200°C
Chemical Debonding	WaferBOND® HT-10.11 and HT-10.12 Materials	Not Applicable	200°C
Mechanical Debonding	WaferBOND® HT-10.11 and HT-10.12 Materials	BrewerBOND^®530	250°C - 300°C
Mechanical Debonding	BrewerBOND^® 305	BrewerBOND^®530	250°C - 300°C

Brewer Science has the expertise and equipment to successfully navigate the entire thin wafer handling process. Our unique proprietary materials, the BrewerBOND^® material suite, enable completion of the complex back-end processing of ultrathin wafers with standard semiconductor equipment. These materials allow the wafers to be processed using standard lithographic, passivation, and metallization techniques and tooling.

Advantages

Higher yields
Low-stress thermal slide and room temperature mechanical debonding
Separation that takes place at the bonding material–carrier interface, not the bonding material–device wafer interface
After separation, the device wafer can be solvent cleaned on standard frames and dicing tapes.Higher throughput and lower cost of ownership