Brewer Science has the expertise and equipment to successfully navigate the entire thin wafer handling process. Our unique proprietary materials, the BrewerBOND® material suite, enable completion of the complex back-end processing of ultrathin wafers with standard semiconductor equipment. These materials allow the wafers to be processed using standard lithographic, passivation, and metallization techniques and tooling.
Advantages
- Higher yields
- Low-stress thermal slide and room temperature mechanical debonding
- Separation that takes place at the bonding material–carrier interface, not the bonding material–device wafer interface
- After separation, the device wafer can be solvent cleaned on standard frames and dicing tapes.Higher throughput and lower cost of ownership
| Technology | Temporary Bonding Material | Compatible Release Layer Material | Thermal Budget |
|---|---|---|---|
| Slide OR Mechanical Debonding | BrewerBOND® 305 | BrewerBOND® 510 | 300°C |
| Excimer Laser Debonding | BrewerBOND® 305 | BrewerBOND® 701 | 300°C |
| Slide OR Mechanical Debonding | BrewerBOND® 220 | BrewerBOND® 510 | 250°C |
| Slide OR Mechanical Debonding | WaferBOND® HT-10.10 | BrewerBOND®510 | 200°C |
| Chemical Debonding | WaferBOND® CR-200 | Not Applicable | 200°C |