Patents
At Brewer Science, we believe that protecting our ideas and inventions is an investment in ourselves and the future of our company. We know that even though changing technologies allow many products to be made more easily and information is much more readily available than ever before, our inventions are no less valuable to us and to the world. Through the security of intellectual property protection, we are able to bring you innovative products.
Nonpolymeric antireflection compositions containing adamantyl groups
Thermosetting polyester anti-reflective coatings for multilayer photoresist processes
Thermosetting polyester anti-reflective coatings for multilayer photoresist processes
Thermosetting polyester anti-reflective coatings for multilayer photoresist processes
Thermosetting anti-reflective coatings at deep ultraviolet
Method for making multilayer resist structures with thermosetting anti-reflective coatings
Non-subliming mid-UV dyes and utra-thin anti-reflective coatings having differential solubility
Thermosetting anti-reflective coatings compositions
Non-subliming mid-UV dyes and ultra-thin organic anti-reflective coatings having differential solubility
Anti-reflective coating
Method for making polymers with intrinsic light-absorbing properties
Photolithographic article utilizing polymers with light-absorbing properties for anti-reflective coating
Anti-reflective coating compositions for use with low-k dielectric materials
Wet-developable anti-reflective compositions
Organic anti-reflective coating compositions for advanced microlithography
Halogenated anti-reflective coatings
Anti-reflective coating of polymer with epoxide rings reacted with light attenuating compound and unreacted epoxide rings
Anti-reflective coating of polymer with epoxide rings reacted with light attenuating compound and unreacted epoxide rings
Anti-reflective coating compositions comprising polymerized aminoplasts
Thermosetting anti-reflective coatings comprising aryl urethanes of hydroxypropyl cellulose
Non-subliming, difunctionalized ultraviolet dyes for use in anti-reflective coatings
Anti-reflective coating compositions comprising polymerized aminoplasts
Anti-reflective coating compositions comprising polymerized aminoplasts
Halogenated anti-reflective coatings
Thermosetting anti-reflective coatings for full fill dual damascene process
Anti-reflective coating compositions comprising polymerized aminoplasts
Anti-reflective coating compositions comprising polymerized aminoplasts
Anti-reflective coating compositions comprising polymerized aminoplasts
Fill material for dual damascene process
Anti-reflective coating compositions comprising polymerized aminoplasts
Fast-etching, thermosetting anti-reflective coatings derived from cellulosic binders
Thermosetting anti-reflective coatings
Anti-reflective coatings using vinyl ether crosslinkers
Acid-sensitive, developer-soluble bottom anti-reflective coatings
Underlayers for EUV lithography
Crosslinkable fill compositions for uniformly protecting via and contact holes
Anti-reflective imaging layer for multiple patterning process
Gap-fill materials and bottom anti-reflective coatings comprising hyperbranched polymers
Gap-fill materials and bottom anti-reflective coatings comprising hyperbranched polymers
Spin bowl compatible polyamic acids/imides as wet developable polymer binders for anti-reflective coatings
Anti-reflective coatings using vinyl ether crosslinkers
Thermally curable middle layer comprising polyhedral oligomeric silsesquioxanes for 193-nm trilayer resist process
Developer-soluble materials and methods of using the same in via-first dual damascene applications
Bottom anti-reflective coatings derived from small core molecules with multiple epoxy moieties
Spin bowl compatible polyamic acids/imides as wet developable polymer binders for anti-reflective coatings
Polymeric antireflective coatings deposited by plasma enhanced chemical vapor deposition
Non-aromatic chromophores for use in polymer anti-reflective coatings
Photosensitive bottom anti-reflective coating
Anti-reflective compositions comprising triazine compounds
Fill material for dual damascene processes
Anti-reflective coating composition with improved spin bowl compatibility
Anti-reflective coatings and dual damascene fill compositions comprising stryrene-allyl alcohol copolymers
On-track process for patterning hardmask by multiple dark field exposures
Photosensitive hardmask for microlithography
Method of filling structures for forming via-first dual damascene interconnects
Wet developable hard mask in conjunction with thin photoresist for microphotolithography
Method of filling structures for forming via-first dual damascene interconnects
Lithography pattern shrink process and articles
Developer-soluble metal alkoxide coatings for microelectronic applications
Spin-on carbon compositions for lithographic processing
Assist layers for EUV lithography
Spin-on carbon compositions for lithographic processing
Methods of producing structures using a developer-soluble layer with multilayer technology
Method of making radiation-sensitive sol-gel materials
Metal-oxide films from small molecules for lithographic applications
On-track process for patterning hardmask by multiple dark field exposures
Photoimageable branched polymer
Method of creating photolithographic structures with developer-trimmed hardmask
Silicon hardmask layer for directed self-assembly
Highly etch-resistant polymer block for use in block copolymers for directed self-assembly
Acid-etch resistant, protective coatings
Spin-on protective coatings for wet-etch processing of microelectronic substrates
Scratch-resistant coatings for protecting front-side circuitry during backside processing
Thermal- and chemical-resistant acid protection coating material and spin-on thermoplastic adhesive
Spin-on protective coatings for wet-etch processing of microelectronic substrates
Spin-on protective coatings for wet-etch processing of microelectronic substrates
Spin-on protective coatings for wet-etch processing of microelectronic substrates
Alkaline-resistant negative photoresist for silicon wet-etch without silicon nitride
Negative photoresist for silicon KOH etch without silicon nitride
Thermal- and chemical-resistant acid protection coating material and spin-on thermoplastic adhesive
Spin-on protective coatings for wet-etch processing of microelectronic substrate
Multiple bonding layers for thin-wafer handling
Multiple bonding layers for thin-wafer handling
Development of high-viscosity bonding layer through in-situ polymer chain extension
Method for reversibly mounting a device wafer to a carrier substrate
Article including a device wafer reversibly mountable to a carrier substrate
Cleaning composition for temporary wafer bonding materials
Method and apparatus for removing a reversibly mounted device wafer from a carrier substrate
Cyclic olefin compositions for temporary wafer bonding
High-temperature spin-on temporary bonding compositions
Cyclic olefin compositions for temporary wafer bonding
Cyclic olefin compositions for temporary wafer bonding
High-temperature spin-on temporary bonding compositions
Thermally decomposable spin-on bonding compositions for temporary wafer bonding
Highly soluble carbon nanotubes with enhanced conductivity
Self-leveling planarization materials for microelectronic topography
Automated process and apparatus for planarization of topographical surfaces
Planarization method for multi-layer lithography processing
Contact planarization materials that generate no volatile byproducts or residue during curing
Process and device for coating the outer edge of a substrate during microelectronics manufacture
Device for coating the outer edge of a substrate during microelectronics manufacturing
Contact planarization apparatus
CVD-free, scalable processes for the production of silicon micro- and nanostructures
Silicone polymers with high refractive indices and extended pot life
Reversal lithography approach by selective deposition of nanoparticles
Fluorinated polyimides with fluorene cardo structure as optical materials that have low absolute thermo-optic coefficients
Materials with thermally reversible curing mechanism
Amine-arresting additives for materials used in photolithographic processes
Hybrid organic-inorganic polymer coatings with high refractive indices
Two-layer transparent electrostatic charge dissipating coating
Photocurable, conductive, transparent polymer coatings
Polyimides for use as high refractive index, thin film materials
Highly plasma etch-resistant photoresist composition containing a photosensitive polymeric titania precursor
High optical density ultra thin organic black matrix system
Conducting-polymer bolometer
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