Patents
At Brewer Science, we believe that protecting our ideas and inventions is an investment in ourselves and the future of our company. We know that even though changing technologies allow many products to be made more easily and information is much more readily available than ever before, our inventions are no less valuable to us and to the world. Through the security of intellectual property protection, we are able to bring you innovative products.
Laser-releasable bonding materials for 3-d IC applications
Gradient block copolymers for directed self-assembly
Superplanarizing spin-on carbon materials
10,770,813Environmentally sealed, reusable connector for printed flexible electronics
10,734,239High-chi block copolymers with tunable glass transition temperatures for directed self-assembly
10,617,010Polymer film stencil process for fan-out wafer-level packaging of semiconductor devices
Multifunctional alcohol dispersions of carbon nanotubes
10,421,878High-Chi block copolymers for directed self-assembly
10,366,887Method of using chemically patterned guide layers in chemoepitaxy directing of block co-polymers
10,352,726Thin-film resistive-based sensor
10,331,032Photosensitive, developer-soluble bottom anti-reflective coating material
10,329,451All-organic high refractive index materials
10,317,291Environmental sensor system and signal processor
10,304,720Laser ablative dielectric material
Spin-on carbon compositions for lithographic processing
10,103,048Dual-layer bonding material process for temporary bonding of microelectronic substrates to carrier substrates
9,960,038Processes to pattern small features for advanced patterning needs
9,865,490Cyclic olefin polymer compositions and polysiloxane release layers for use in temporary wafer bonding processes
Methods of transferring device wafers or layers between carrier substrates and other surfaces
9,827,740Polyimides as laser release materials for 3-D IC applications
9,738,805Highly soluble carbon nanotubes with enhanced conductivity
9,728,439High-temperature, spin-on, bonding compositions for temporary wafer bonding using sliding approach
9,642,258All-organic inductor-capacitor tank circuit for radio frequency sensor applications
9,640,396Spin-on spacer materials for double- and triple-patterning lithography
9,638,999Dual-layer light-sensitive developer soluble bottom anti-reflective coatings for 193-nm lithography
Highly crosslinked polymer dielectric films for improved capacitor performance
Cyclic olefin polymer compositions and polysiloxane release layers for use in temporary wafer bonding processes
9,482,951Non-covalently crosslinkable materials for photolithography processes
9,472,436Multiple bonding layers for thin-wafer handling
9,328,426Nonpolymeric antireflection compositions containing adamantyl groups
9,299,778CVD-free, scalable processes for the production of silicon micro- and nanostructures
9,263,314Multiple bonding layers for thin-wafer handling
9,249,013Silicon hardmask layer for directed self-assembly
Silicone polymers with high refractive indices and extended pot life
9,224,631Multiple bonding layers for thin-wafer handling
9,127,126Development of high-viscosity bonding layer through in-situ polymer chain extension
9,111,981Method for reversibly mounting a device wafer to a carrier substrate
9,099,512Article including a device wafer reversibly mountable to a carrier substrate
8,940,104Cleaning composition for temporary wafer bonding materials
9,157,003Highly soluble carbon nanotubes with enhanced conductivity
9,123,541Highly etch-resistant polymer block for use in block copolymers for directed self-assembly
9,102,129Spin-on carbon compositions for lithographic processing
8,968,989Assist layers for EUV lithography
9,110,372Anti-reflective coatings using vinyl ether crosslinkers
Reversal lithography approach by selective deposition of nanoparticles
8,668,992Fluorinated polyimides with fluorene cardo structure as optical materials that have low absolute thermo-optic coefficients
8,852,391Method and apparatus for removing a reversibly mounted device wafer from a carrier substrate
8,771,442Cyclic olefin compositions for temporary wafer bonding
8,865,599Self-leveling planarization materials for microelectronic topography
8,771,927Acid-etch resistant, protective coatings
8,895,230Spin-on carbon compositions for lithographic processing
8,877,430Methods of producing structures using a developer-soluble layer with multilayer technology
8,808,969Method of making radiation-sensitive sol-gel materials
8,647,809Metal-oxide films from small molecules for lithographic applications
Device for coating the outer edge of a substrate during microelectronics manufacturing
8,445,591Spin-on protective coatings for wet-etch processing of microelectronic substrates
8,399,346Scratch-resistant coatings for protecting front-side circuitry during backside processing
8,415,083On-track process for patterning hardmask by multiple dark field exposures
8,383,318Acid-sensitive, developer-soluble bottom anti-reflective coatings
High-temperature spin-on temporary bonding compositions
8,221,571Cyclic olefin compositions for temporary wafer bonding
8,092,628Cyclic olefin compositions for temporary wafer bonding
8,133,659On-track process for patterning hardmask by multiple dark field exposures
8,268,449Thermal- and chemical-resistant acid protection coating material and spin-on thermoplastic adhesive
8,202,442Spin-on protective coatings for wet-etch processing of microelectronic substrates
8,192,642Spin-on protective coatings for wet-etch processing of microelectronic substrates
8,206,893Photoimageable branched polymer
8,168,372Method of creating photolithographic structures with developer-trimmed hardmask
8,257,910Underlayers for EUV lithography
Materials with thermally reversible curing mechanism
7,935,780High-temperature spin-on temporary bonding compositions
7,939,244Photosensitive hardmask for microlithography
7,998,318Crosslinkable fill compositions for uniformly protecting via and contact holes
7,914,974Anti-reflective imaging layer for multiple patterning process
Amine-arresting additives for materials used in photolithographic processes
7,803,458Hybrid organic-inorganic polymer coatings with high refractive indices
7,749,603Two-layer transparent electrostatic charge dissipating coating
7,713,835Thermally decomposable spin-on bonding compositions for temporary wafer bonding
7,790,231Automated process and apparatus for planarization of topographical surfaces
7,775,785Contact planarization apparatus
7,758,913Spin-on protective coatings for wet-etch processing of microelectronic substrates
7,709,178Alkaline-resistant negative photoresist for silicon wet-etch without silicon nitride
7,695,890Negative photoresist for silicon KOH etch without silicon nitride
7,678,861Thermal- and chemical-resistant acid protection coating material and spin-on thermoplastic adhesive
7,754,818Gap-fill materials and bottom anti-reflective coatings comprising hyperbranched polymers
7,745,540Gap-fill materials and bottom anti-reflective coatings comprising hyperbranched polymers
Photocurable, conductive, transparent polymer coatings
7,602,066Method of filling structures for forming via-first dual damascene interconnects
7,608,380Spin bowl compatible polyamic acids/imides as wet developable polymer binders for anti-reflective coatings
7,601,483Anti-reflective coatings using vinyl ether crosslinkers
7,507,783Thermally curable middle layer comprising polyhedral oligomeric silsesquioxanes for 193-nm trilayer resist process
Planarization method for multi-layer lithography processing
7,364,832Wet developable hard mask in conjunction with thin photoresist for microphotolithography
7,348,281Method of filling structures for forming via-first dual damascene interconnects
7,316,844Spin-on protective coatings for wet-etch processing of microelectronic substrate
7,364,835Developer-soluble materials and methods of using the same in via-first dual damascene applications
7,323,289Bottom anti-reflective coatings derived from small core molecules with multiple epoxy moieties
Process and device for coating the outer edge of a substrate during microelectronics manufacture
7,122,296Lithography pattern shrink process and articles
7,132,219Polymeric antireflective coatings deposited by plasma enhanced chemical vapor deposition
7,132,216Non-aromatic chromophores for use in polymer anti-reflective coatings
7,108,958Photosensitive bottom anti-reflective coating
7,038,328Anti-reflective compositions comprising triazine compounds
Organic anti-reflective coating compositions for advanced microlithography
6,893,684Anti-reflective coating compositions for use with low-k dielectric materials
6,872,506Wet-developable anti-reflective compositions
6,846,612Organic anti-reflective coating compositions for advanced microlithography
7,026,237Fill material for dual damascene processes
6,962,769Anti-reflective coating composition with improved spin bowl compatibility
6,894,104Anti-reflective coatings and dual damascene fill compositions comprising stryrene-allyl alcohol copolymers
Anti-reflective coating of polymer with epoxide rings reacted with light attenuating compound and unreacted epoxide rings
6,663,916Anti-reflective coating of polymer with epoxide rings reacted with light attenuating compound and unreacted epoxide rings
6,653,411Anti-reflective coating compositions comprising polymerized aminoplasts
Thermosetting anti-reflective coatings comprising aryl urethanes of hydroxypropyl cellulose
Non-subliming, difunctionalized ultraviolet dyes for use in anti-reflective coatings
Anti-reflective coating compositions comprising polymerized aminoplasts
6,512,084Anti-reflective coating compositions comprising polymerized aminoplasts
Halogenated anti-reflective coatings
Thermosetting anti-reflective coatings for full fill dual damascene process
6,432,611Anti-reflective coating compositions comprising polymerized aminoplasts
6,403,152Anti-reflective coating compositions comprising polymerized aminoplasts
6,399,686Anti-reflective coating compositions comprising polymerized aminoplasts
6,391,472Fill material for dual damascene process
Thermosetting polyester anti-reflective coatings for multilayer photoresist processes
Thermosetting polyester anti-reflective coatings for multilayer photoresist processes
Thermosetting anti-reflective coatings
High optical density ultra thin organic black matrix system
Thermosetting polyester anti-reflective coatings for multilayer photoresist processes
Thermosetting anti-reflective coatings at deep ultraviolet
Method for making multilayer resist structures with thermosetting anti-reflective coatings
Non-subliming mid-UV dyes and utra-thin anti-reflective coatings having differential solubility
Conducting-polymer bolometer
Thermosetting anti-reflective coatings compositions
Non-subliming mid-UV dyes and ultra-thin organic anti-reflective coatings having differential solubility
Anti-reflective coating
Method for making polymers with intrinsic light-absorbing properties
Organic anti-reflective coating compositions for advanced microlithography
10,331,032Photosensitive, developer-soluble bottom anti-reflective coating material
9,638,999Dual-layer light-sensitive developer soluble bottom anti-reflective coatings for 193-nm lithography
9,482,951Non-covalently crosslinkable materials for photolithography processes
9,328,426Nonpolymeric antireflection compositions containing adamantyl groups
Thermosetting polyester anti-reflective coatings for multilayer photoresist processes
Thermosetting polyester anti-reflective coatings for multilayer photoresist processes
Thermosetting polyester anti-reflective coatings for multilayer photoresist processes
Thermosetting anti-reflective coatings at deep ultraviolet
Method for making multilayer resist structures with thermosetting anti-reflective coatings
Non-subliming mid-UV dyes and utra-thin anti-reflective coatings having differential solubility
Thermosetting anti-reflective coatings compositions
Non-subliming mid-UV dyes and ultra-thin organic anti-reflective coatings having differential solubility
Anti-reflective coating
Method for making polymers with intrinsic light-absorbing properties
Photolithographic article utilizing polymers with light-absorbing properties for anti-reflective coating
6,893,684Anti-reflective coating compositions for use with low-k dielectric materials
6,872,506Wet-developable anti-reflective compositions
6,846,612Organic anti-reflective coating compositions for advanced microlithography
6,680,160Halogenated anti-reflective coatings
6,670,425Anti-reflective coating of polymer with epoxide rings reacted with light attenuating compound and unreacted epoxide rings
6,663,916Anti-reflective coating of polymer with epoxide rings reacted with light attenuating compound and unreacted epoxide rings
6,653,411Anti-reflective coating compositions comprising polymerized aminoplasts
Thermosetting anti-reflective coatings comprising aryl urethanes of hydroxypropyl cellulose
Non-subliming, difunctionalized ultraviolet dyes for use in anti-reflective coatings
Anti-reflective coating compositions comprising polymerized aminoplasts
6,512,084Anti-reflective coating compositions comprising polymerized aminoplasts
Halogenated anti-reflective coatings
Thermosetting anti-reflective coatings for full fill dual damascene process
6,432,611Anti-reflective coating compositions comprising polymerized aminoplasts
6,403,152Anti-reflective coating compositions comprising polymerized aminoplasts
6,399,686Anti-reflective coating compositions comprising polymerized aminoplasts
6,391,472Fill material for dual damascene process
6,323,310Anti-reflective coating compositions comprising polymerized aminoplasts
6,316,160Fast-etching, thermosetting anti-reflective coatings derived from cellulosic binders
6,156,479Thermosetting anti-reflective coatings
9,110,372Anti-reflective coatings using vinyl ether crosslinkers
8,383,318Acid-sensitive, developer-soluble bottom anti-reflective coatings
8,257,910Underlayers for EUV lithography
7,998,318Crosslinkable fill compositions for uniformly protecting via and contact holes
7,914,974Anti-reflective imaging layer for multiple patterning process
7,754,818Gap-fill materials and bottom anti-reflective coatings comprising hyperbranched polymers
7,745,540Gap-fill materials and bottom anti-reflective coatings comprising hyperbranched polymers
7,608,380Spin bowl compatible polyamic acids/imides as wet developable polymer binders for anti-reflective coatings
7,601,483Anti-reflective coatings using vinyl ether crosslinkers
7,507,783Thermally curable middle layer comprising polyhedral oligomeric silsesquioxanes for 193-nm trilayer resist process
7,364,835Developer-soluble materials and methods of using the same in via-first dual damascene applications
7,323,289Bottom anti-reflective coatings derived from small core molecules with multiple epoxy moieties
7,261,997Spin bowl compatible polyamic acids/imides as wet developable polymer binders for anti-reflective coatings
7,132,219Polymeric antireflective coatings deposited by plasma enhanced chemical vapor deposition
7,132,216Non-aromatic chromophores for use in polymer anti-reflective coatings
7,108,958Photosensitive bottom anti-reflective coating
7,038,328Anti-reflective compositions comprising triazine compounds
7,026,237Fill material for dual damascene processes
6,962,769Anti-reflective coating composition with improved spin bowl compatibility
6,894,104Anti-reflective coatings and dual damascene fill compositions comprising stryrene-allyl alcohol copolymers
Gradient block copolymers for directed self-assembly
High-chi block copolymers with tunable glass transition temperatures for directed self-assembly
10,421,878High-Chi block copolymers for directed self-assembly
10,366,887Method of using chemically patterned guide layers in chemoepitaxy directing of block co-polymers
9,249,013Silicon hardmask layer for directed self-assembly
9,123,541Highly etch-resistant polymer block for use in block copolymers for directed self-assembly
Self-leveling planarization materials for microelectronic topography
7,790,231Automated process and apparatus for planarization of topographical surfaces
7,455,955Planarization method for multi-layer lithography processing
6,716,767Contact planarization materials that generate no volatile byproducts or residue during curing
All-organic high refractive index materials
9,496,164Cyclic olefin polymer compositions and polysiloxane release layers for use in temporary wafer bonding processes
9,299,778CVD-free, scalable processes for the production of silicon micro- and nanostructures
9,117,757Silicone polymers with high refractive indices and extended pot life
8,836,082Reversal lithography approach by selective deposition of nanoparticles
8,668,992Fluorinated polyimides with fluorene cardo structure as optical materials that have low absolute thermo-optic coefficients
7,976,894Materials with thermally reversible curing mechanism
7,833,692Amine-arresting additives for materials used in photolithographic processes
7,803,458Hybrid organic-inorganic polymer coatings with high refractive indices
7,749,603Two-layer transparent electrostatic charge dissipating coating
7,608,342Photocurable, conductive, transparent polymer coatings
7,192,999Polyimides for use as high refractive index, thin film materials
6,303,270Highly plasma etch-resistant photoresist composition containing a photosensitive polymeric titania precursor
High optical density ultra thin organic black matrix system
Conducting-polymer bolometer
Laser-releasable bonding materials for 3-d IC applications
Polymer film stencil process for fan-out wafer-level packaging of semiconductor devices
10,304,720Laser ablative dielectric material
10,103,048Dual-layer bonding material process for temporary bonding of microelectronic substrates to carrier substrates
9,865,490Cyclic olefin polymer compositions and polysiloxane release layers for use in temporary wafer bonding processes
9,827,757Methods of transferring device wafers or layers between carrier substrates and other surfaces
9,827,740Polyimides as laser release materials for 3-D IC applications
9,728,439High-temperature, spin-on, bonding compositions for temporary wafer bonding using sliding approach
9,472,436Multiple bonding layers for thin-wafer handling
9,263,314Multiple bonding layers for thin-wafer handling
9,224,631Multiple bonding layers for thin-wafer handling
9,127,126Development of high-viscosity bonding layer through in-situ polymer chain extension
9,111,981Method for reversibly mounting a device wafer to a carrier substrate
9,099,512Article including a device wafer reversibly mountable to a carrier substrate
8,940,104Cleaning composition for temporary wafer bonding materials
8,852,391Method and apparatus for removing a reversibly mounted device wafer from a carrier substrate
8,771,442Cyclic olefin compositions for temporary wafer bonding
8,236,669High-temperature spin-on temporary bonding compositions
8,221,571Cyclic olefin compositions for temporary wafer bonding
8,092,628Cyclic olefin compositions for temporary wafer bonding
7,935,780High-temperature spin-on temporary bonding compositions
7,713,835Thermally decomposable spin-on bonding compositions for temporary wafer bonding
Acid-etch resistant, protective coatings
8,445,591Spin-on protective coatings for wet-etch processing of microelectronic substrates
8,399,346Scratch-resistant coatings for protecting front-side circuitry during backside processing
8,268,449Thermal- and chemical-resistant acid protection coating material and spin-on thermoplastic adhesive
8,202,442Spin-on protective coatings for wet-etch processing of microelectronic substrates
8,192,642Spin-on protective coatings for wet-etch processing of microelectronic substrates
7,758,913Spin-on protective coatings for wet-etch processing of microelectronic substrates
7,709,178Alkaline-resistant negative photoresist for silicon wet-etch without silicon nitride
7,695,890Negative photoresist for silicon KOH etch without silicon nitride
7,678,861Thermal- and chemical-resistant acid protection coating material and spin-on thermoplastic adhesive
7,316,844Spin-on protective coatings for wet-etch processing of microelectronic substrate
Superplanarizing spin-on carbon materials
RE46,841Spin-on carbon compositions for lithographic processing
9,960,038Processes to pattern small features for advanced patterning needs
9,640,396Spin-on spacer materials for double- and triple-patterning lithography
8,133,659On-track process for patterning hardmask by multiple dark field exposures
7,939,244Photosensitive hardmask for microlithography
7,602,066Method of filling structures for forming via-first dual damascene interconnects
7,364,832Wet developable hard mask in conjunction with thin photoresist for microphotolithography
7,348,281Method of filling structures for forming via-first dual damascene interconnects
7,122,296Lithography pattern shrink process and articles
6,740,469Developer-soluble metal alkoxide coatings for microelectronic applications
9,102,129Spin-on carbon compositions for lithographic processing
8,968,989Assist layers for EUV lithography
8,895,230Spin-on carbon compositions for lithographic processing
8,877,430Methods of producing structures using a developer-soluble layer with multilayer technology
8,808,969Method of making radiation-sensitive sol-gel materials
8,647,809Metal-oxide films from small molecules for lithographic applications
8,415,083On-track process for patterning hardmask by multiple dark field exposures
8,206,893Photoimageable branched polymer
8,168,372Method of creating photolithographic structures with developer-trimmed hardmask
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