Gapfilling and Planarization Materials

Gapfill and Planarizing Materials for Every Need

Brewer Science's gapfill and planarizing materials are designed to planarize a multitude of incoming substrates with tight pitch and high-aspect-ratio topographies. Our materials are designed to be compatible with common upstream and downstream processes and materials to enable a wide spectrum of integration options for our customers.

Multiple Material Platforms

The planarizing carbon layer, or spin-on-carbon (SOC) layer, is an essential material to planarize incoming substrate and provide the desired optical control and etch transfers. Brewer Science’s OptiStack® materials are robust, industry-proven SOC products that fulfill most gapfilling, planarizing, and etch transfer needs.

Benefits

Compatible with a variety of incoming substrates, such as Si, oxide, nitride, TiN, carbon hardmask, and others
Designed for coat track installation to simplify process integration and reduce capital requirements
Gapfilling as low as <10 nm without void
Planarizes over darkfield and brightfield structures as well as a wide range of pitches (<50 nm up to multiple microns). Long-range planarity can be further improved through etch-back or CMP processes
Both silicon and organic materials are available to enable process design with existing etch and clean schemes
Ultralow ions and defects, as well as complete removability, enables increased device yield
Solutions available for large-area as well as high-aspect-ratio processing and are combined with applications support to help optimize your process

Gapfilling and Planarization Materials

Gapfill and Planarizing Materials for Every Need

Multiple Material Platforms

Benefits

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