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May 31st thru June 4th, 2022 Event
ECTC (Electronic Components and Technology Conference) 2022

The Electronic Components and Technology Conference (ECTC) is the premier international event that brings together the best in packaging, components and microelectronic systems science, technology and education in an environment…

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May 18th thru 31st Event
SMC (Strategic Materials Conference) Korea 2022

Brewer Science will be exhibiting at the SMC (Strategic Materials Conference) Korea 2022. Check out our virtual booth to learn more about our innovative approach to EUV lithography. Yichen Liang…

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April 07, 2022 Press Release
Brewer Science Earns Intel’s 2022 EPIC Distinguished Supplier Award

Brewer Science Earns Intel’s 2022 EPIC Distinguished Supplier Award Brewer Science is one of only 26 Distinguished Award recipients across Intel’s global supply chain   Rolla, MO. April 7, 2022…

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April 28-29 Event
CMC (Critical Materials for Semiconductor) Conference

Rama Puligadda will be presenting New Developments in Temporary and Permanent Bonding Material Technologies for Advanced Packaging at the CMC Conference. Brewer Science is a "Coffee Break Sponsor" at this…

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April 23 - 28 Event
SPIE Advanced Lithography

As the primary global lithography event, the SPIE Advanced Lithography technical program focuses on works in optical lithography, metrology, and EUV. Jakub Kosa will be presenting, High-temperature stable spin-on carbon…

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Event
Wafer-level polymer/metal hybrid bonding using a photosensitive permanent bonding material featured in Chip Scale Review

Baron Huang, Mei Dong, Shelly Fowler, Andrea Chacko, and Rama Puligadda contributed to Chip Scale Review with a discussion of Wafer-level polymer/metal hybrid bonding using a photosensitive permanent bonding material.…

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March 29, 2022 Press Release
Brewer Science Expands Analytical and Application Testing Services

Brewer Science Expands Analytical and Application Testing Services Chemical, Polymer, Trace Impurity, On-Wafer & Thin Film Characterization among many testing services company offers   Rolla, Mo. March 30, 2022 –…

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Recent Tweets

Kim Yess is chairing the panel discussion, "Solving Diversification Challenges and Workforce Retention Issues" on the Growth Panel and Reception on Wednesday, June 1st at 6:30pm at ECTC. hubs.li/Q019rtjj0 . . . @IEEEorg #ECTC2022 #Electronics #Technology #TechConference #

Thinner films combined with higher processing temperatures are among the challenges Rama Puligadda addresses in her recent interview with @SemiEngineering. Read the full interview on their website: hubs.li/Q019qC2G0

Brewer Science will be exhibiting at the SMC Korea 2022, by @SEMIAmericas. Yichen Liang will be presenting, Application of spin-on-glass underlayer on printing high-resolution line/space and contact hole patterning using extreme ultraviolet lithography. hubs.li/Q019rzVs0

Do you enjoy leading technical teams, and providing management to achieve company R&D objectives? Can you translate customer needs and applications into innovative technical directions for R&D to pursue?You might be the Senior Scientist we're looking for! hubs.li/Q019rfZh0

test Twitter Media - Do you enjoy leading technical teams, and providing management to achieve company R&D objectives? Can you translate customer needs and applications into innovative technical directions for R&D to pursue?You might be the Senior Scientist we're looking for! https://t.co/YxVNUFi9gf https://t.co/hsfI32nIiT

Downscaling is a never-ending task for the semiconductor industry to meet the ever-increasing electronic system demands for higher performance and functionality, smaller system form factor, and lower power consumption and cost. Read more: hubs.ly/Q017Mn7H0

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