Brewer Science to Share Advanced Packaging Expertise, Showcase Technology Offerings at SEMICON Taiwan 2019

Rolla, Mo., and Taipei, Taiwan – September 13, 2019

Rolla, Mo., and Taipei, Taiwan – September 13, 2019 – Brewer Science, Inc., today announced it will participate for the fourteenth consecutive year in SEMICON Taiwan, the country’s largest annual microelectronics event, to be held September 18-20, 2019, at TWTC Nangang Exhibition Center in Taipei. In addition to showcasing its offerings in Booth N0262, Brewer Science is presenting at and sponsoring the SiP Global Summit 2019, a key program on advanced packaging being held in conjunction with the conference.

Focused on “Heterogenous Integration NOW and Future,” the SiP Global Summit will be held at CTBC Financial Park, near the exhibition center, and will span three days of presentations on various topics related to advanced packaging. Kim Arnold, Executive Director, Wafer-Level Packaging for Brewer Science, will present at 2:00 p.m. on Friday, September 20. Titled “Advancement of Materials to Enable Advanced Packaging,” her talk will introduce newly developed materials and platforms for advanced packaging, especially system-in-packaging (SiP). These materials and platforms include new laser release materials, multiple-function materials, and permanent materials. She will also discuss the concept of material design and provide application examples.​

Products and Technology

Brewer Science experts will be on hand in the company’s booth at SEMICON Taiwan to discuss technology trends and how Brewer Science’s products enrich people’s everyday lives, sharing details and capabilities of the products that Brewer Science will be featuring on the show floor.

Wafer-Level Packaging

Brewer Science’s proven temporary wafer bonding (TWB) systems are designed to fit into a variety of process scenarios with minimal disruption. At SEMICON Taiwan, Brewer Science will feature its BrewerBOND® dual-layer TWB system using BrewerBOND® T1100- and C1300-series materials. The system is compatible with both mechanical and laser debonding methods, enables mechanical stability with no movement of bonding materials, and provides thermal stability up to 400°C. Ultrathin silicon and high-stress EMC wafers are two key applications.

In addition, Brewer Science will show its BrewerBUILD™ multifunctional laser-assist materials, which help enable processing in wafer-level packaging. These materials offer improvements for the redistribution layer (RDL)-first build-up process, increasing both throughput and device yield and contributing to lower overall cost of ownership. Other applications include embossing, temporary bonding, laser patterning and die attach.

Lithography

Brewer Science offers the industry’s most comprehensive lithography materials lineup, with products that span the entire spectrum of lithography wavelengths. At SEMICON Taiwan, Brewer Science will show its OptiStack® multilayer materials and its materials for extreme ultraviolet (EUV) lithography.

OptiStack® materials enable advanced multipatterning schemes and provide room- to high- temperature stability, to keep defects low. The materials are also compatible with a broad range of lithography processes – KrF, ArF, ArFi and advanced planarization. The versatile material design allows optimization of existing multilayer processes for new nodes and products.

Brewer Science® E2Stack® materials are the industry standard for EUV underlayers, enabling faster development of EUV photoresist and processes. The company has also developed an innovative technique using metal-oxide-based materials to achieve higher-resolution resists and lower-dose hard masks.

Printed Electronics

As the market for printed electronics technologies continues to grow, Brewer Science is leveraging its materials expertise in unique ways to offer complete end-to-end solutions that enrich our customers’ lives. These solutions span from printed materials to flexible electronics design, manufacturing and testing, as well as the company’s InFlect™ printed sensor solutions.  The company utilizes unique architectures and customizable form factors to achieve near-seamless integration into existing systems for in-depth, actionable insights into processes, machinery, and the surrounding environment.

About Brewer Science

Brewer Science is a global leader in developing and manufacturing next-generation materials and processes that foster the technology needed for tomorrow. Since 1981, we’ve expanded our technology portfolio within advanced lithography, advanced packaging, and printed electronics to enable cutting-edge microdevices and unique monitoring systems for industrial, environmental, and air applications. Our relationship-focused approach provides outcomes that facilitate and deliver critical information. Our headquarters are in Rolla, Missouri, with customer support throughout the world. We invite you to learn more about Brewer Science at www.brewerscience.com.

Company Contact:

Nicholas Skelton, Marketing Manager

Tel: (US) +1.573.364.0300

Email: nskelton@brewerscience.com

Asia Press Contact:
Ina Chu
Tel: (US) +1.217.766.1011 Email: ichu@kiterocket.com