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Upcoming Events

Ongoing Event
TechBlick Year Round Event Series On Emerging Technologies

Brewer Science is exhibiting a virtual booth and a sponsor of the TechBlick Year Round Event Series On Emerging Technologies. The 2021 event focus surrounds Electronics, Photovoltaics, Displays, Sensors, Printed,…

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Past Events

April 12 - 15, 2021 Event
IMAPS Device Packaging Conference 2021

The 17th Annual Device Packaging Conference (DPC 2020) will be held in Fountain Hills, Arizona, from April 12-15, 2021. It is an international event organized by the International Microelectronics Assembly…

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March 23-25, 2021 Event
Printed Electronics With Integrated Sensors to a New Way of ‘Smart Living’

Printed Electronics With Integrated Sensors to a New Way of 'Smart Living' Join Rob Frueh, Sr. Manager of Business Development at Brewer Science, and a panel of experts on the…

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March 23-25, 2021 Event
LOPEC 2021

LOPEC (Large-area, Organic & Printed Electronics Convention) is the leading trade fair and the most important congress for the printed electronics industry. The event usually takes place at Messe Munchen…

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March 17-19, 2021 Event
SEMICON China 2021

SEMICON China connects you to the world’s fastest-growing and most dynamic microelectronics market, and gives you the platform to showcase your products, technologies, and brand in front of the most…

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March 14-15, 2021 Event
CSTIC (China Semiconductor Technology International Conference)

CSTIC 2021 is one of the largest and the most comprehensive annual semiconductor technology conferences in China and Asia since 2000. Organized by SEMI, IMEC and IEEE-EDS, co-organized by IMECAS.…

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February 22-26, 2021 Event
SPIE Advanced Lithography Virtual Conference 2021

As the primary global lithography event, the SPIE Advanced Lithography technical program focuses on works in optical lithography, metrology, and EUV. Industry and academic leaders come to solve challenges in…

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February 22-26, 2021 Event
FLEX 2021 Virtual Conference

FLEX, the flexible hybrid electronics (FHE) go-to event, is the center of technical and informative demonstration of flexible hybrid, printed electronics products, equipment, processes, materials, and the applications they enable.…

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Jan. 27th at 12pmCST Event
MSU Bicentennial Webinar Series: Changing Lives Through Technology, Science and Innovation

Dr. Brewer presented at Missouri State University's Bicentennial Webinar Series: "Changing Lives Through Technology, Science and Innovation" on January 27th at 12pmCST. If you were unable to attend the virtual…

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October 22-23, 2020 Event
Critical Materials for Semiconductor Conference (CMC) 2020

October 22 & 23 CMC Conference preceded by CMC Meeting at Intel on October 20-21 Featuring Keynote: Bruce Tufts, VP Technology & Manufacturing Group, Director, Fab Materials, Intel Corp with…

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Recent Tweets

Check out the research article, High-Temperature-Stable, Spin-On Carbon Materials For High-Aspect-Ratio Gap-Fill Applications" written by Carissa Jones, Runhui Huang, Joyce Lowes, Sean Simmons, and Xing-Fu Zhong of Brewer Science, Inc. hubs.li/H0SCpNy0

Brewer Science is looking for a Director, Business Operations/Development to join our Smart Devices Foundry in Springfield, MO. Learn more about the position and other current job openings by visiting : hubs.li/H0Skl3j0

test Twitter Media - Brewer Science is looking for a Director, Business Operations/Development to join our Smart Devices Foundry in Springfield, MO. Learn more about the position and other current job openings by visiting : https://t.co/GFLoukA1Ll https://t.co/QQ9Zt7wxCr

Xiao Liu, senior program manager from Brewer Science, is referenced in Semiconductor Engineering's article, "Bumps Vs. Hybrid Bonding For Advanced Packaging". Check it out here: hubs.li/H0RrBqx0

“We are excited to help @WBSSTL , It’s a great way to celebrate Brewer Science’s 40th Anniversary marking our entrance into the semiconductor industry, by providing the World Bird Sanctuary with an entrance into their park” hubs.li/H0SCw6J0

Arthur Southard, a researcher at Brewer Science, discusses with @SemiEngineering the role redistribution layers (RDLs) play in wafer-level packaging. Read more in, "Advanced Packaging's Next Wave" hubs.li/H0RrwBY0

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