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Brewer Science is exhibiting a virtual booth and a sponsor of the TechBlick Year Round Event Series On Emerging Technologies. The 2021 event focus surrounds Electronics, Photovoltaics, Displays, Sensors, Printed, Flexible, Hybrid, Roll-to-Roll, Structural, InMold, 3D, Conformal, Large-Area, Stretchable, Textile, Wearable, Patches, Transparent. As well as Material Innovations, such as Energy Storage Materials, Graphene and…
Ongoing Event Read MoreBrewer Science is exhibiting a virtual booth and a sponsor of the TechBlick Year Round Event Series On Emerging Technologies. The 2021 event focus surrounds Electronics, Photovoltaics, Displays, Sensors, Printed,…
Read MoreThe 17th Annual Device Packaging Conference (DPC 2020) will be held in Fountain Hills, Arizona, from April 12-15, 2021. It is an international event organized by the International Microelectronics Assembly…
Read MorePrinted Electronics With Integrated Sensors to a New Way of 'Smart Living' Join Rob Frueh, Sr. Manager of Business Development at Brewer Science, and a panel of experts on the…
Read MoreLOPEC (Large-area, Organic & Printed Electronics Convention) is the leading trade fair and the most important congress for the printed electronics industry. The event usually takes place at Messe Munchen…
Read MoreSEMICON China connects you to the world’s fastest-growing and most dynamic microelectronics market, and gives you the platform to showcase your products, technologies, and brand in front of the most…
Read MoreCSTIC 2021 is one of the largest and the most comprehensive annual semiconductor technology conferences in China and Asia since 2000. Organized by SEMI, IMEC and IEEE-EDS, co-organized by IMECAS.…
Read MoreAs the primary global lithography event, the SPIE Advanced Lithography technical program focuses on works in optical lithography, metrology, and EUV. Industry and academic leaders come to solve challenges in…
Read MoreFLEX, the flexible hybrid electronics (FHE) go-to event, is the center of technical and informative demonstration of flexible hybrid, printed electronics products, equipment, processes, materials, and the applications they enable.…
Read MoreDr. Brewer presented at Missouri State University's Bicentennial Webinar Series: "Changing Lives Through Technology, Science and Innovation" on January 27th at 12pmCST. If you were unable to attend the virtual…
Read MoreOctober 22 & 23 CMC Conference preceded by CMC Meeting at Intel on October 20-21 Featuring Keynote: Bruce Tufts, VP Technology & Manufacturing Group, Director, Fab Materials, Intel Corp with…
Read MoreJuly 19, 2021
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June 28, 2021
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June 22, 2021
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Check out the research article, High-Temperature-Stable, Spin-On Carbon Materials For High-Aspect-Ratio Gap-Fill Applications" written by Carissa Jones, Runhui Huang, Joyce Lowes, Sean Simmons, and Xing-Fu Zhong of Brewer Science, Inc. hubs.li/H0SCpNy0
Brewer Science is looking for a Director, Business Operations/Development to join our Smart Devices Foundry in Springfield, MO. Learn more about the position and other current job openings by visiting : hubs.li/H0Skl3j0
Xiao Liu, senior program manager from Brewer Science, is referenced in Semiconductor Engineering's article, "Bumps Vs. Hybrid Bonding For Advanced Packaging". Check it out here: hubs.li/H0RrBqx0
“We are excited to help @WBSSTL , It’s a great way to celebrate Brewer Science’s 40th Anniversary marking our entrance into the semiconductor industry, by providing the World Bird Sanctuary with an entrance into their park” hubs.li/H0SCw6J0
Arthur Southard, a researcher at Brewer Science, discusses with @SemiEngineering the role redistribution layers (RDLs) play in wafer-level packaging. Read more in, "Advanced Packaging's Next Wave" hubs.li/H0RrwBY0
July 02, 2021
[+] Read MoreBrewer Science • June 24, 2021
[+] Read MoreBrewer Science • May 24, 2021
[+] Read MoreBrewer Science • April 20, 2021
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