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300-mm Ultrathin Wafer Handling: Presentation Highlights High-Temperature-Stable Temporary Bonding and IR Laser Debonding with Si Carriers Chemnitz, Germany. – December 2, 2025 – Brewer Science, in collaboration with EV…
December 02, 2025 Press Release Read MoreHow My Internship at Brewer Science Shows Me the Power of Teamwork and Innovation By Wyatt Harris, Marketing Intern at Brewer Science This past summer, I was given the opportunity…
Read MoreBrewer Science Showcases Advanced-Node and Wafer-Thinning Materials for Energy-Efficient Semiconductor Manufacturing Visit Booth #B1465 at SEMICON Europa to explore PFAS-free, high-performance materials enabling next-gen AI packaging Munich, Germany –…
Read MoreBrewer Science will be presenting at the AIChE Annual Meeting 2025. Presentation Details: Machine Learning-Driven Raman Spectroscopy for In-Line Monitoring of Continuous Flow Polymerization Presented by: James Halpryn, Process…
Read MoreBrewer Science will present at NextFlex Workshop: Hybrid Electronics for Automotive and Aerospace Applications on October 15 – 16, 2025 in Huntsville, Alabama. Dr. Adam Scotch will present Building Circuits…
Read MoreBrewer Science Expands U.S. Operations with New Chandler, Arizona Office and Lab Collaboration with semiconductor customers and research partners, access to talent among key considerations CHANDLER, Arizona. –…
Read MoreBrewer Science will be co-presenting at 27th Electronics Packaging Technology Conference (EPTC), December 2nd through December 5th at Resorts World in Sentosa, Singapore. Brewer Science is a Bronze Sponsor of…
Read MoreParticipating in the Next-Generation Semiconductor Packaging Consortium "JOINT3" Brewer Science has joined the next-generation semiconductor packaging consortium "JOINT3." September 3, 2025 - JOINT3 is a co-creation evaluation platform established by…
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