International Wafer-Level Packaging Conference

October 13 - 15, 2020

Bridging the Boundaries: Wafer, Panel and Beyond October 13 – 15, 2020 DoubleTree by Hilton San Jose San Jose, California, USA The SMTA and Chip Scale Review are pleased to announce plans for the 17th Annual International Wafer-Level Packaging Conference and Tabletop Exhibition. This premier industry event explores leading-edge design, material, and process technologies being applied to Wafer-Level Packaging applications. There will be special emphasis on the numerous device and end product applications (RF/wireless, sensors, mixed technology, optoelectronics) that demand wafer level packaging solutions for integration, cost, and performance requirements.

Learn more on the conference website

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