3D ASIP

December 5 - 7, 2017

3D ASIPTuesday, December 5, 2017
San Francisco, CA, USA

 

Brewer Science’s Kim Yess, Business Technology Director, Wafer-Level Packaging Materials Division, to discuss The Evolution of Substrate Build-up and Thin Wafer Handling in an invited talk at 3D ASIP:

Tuesday, December 5, 2017
SESSION 3 Equipment & Materials
5:00pm-5:20pm

Check out the program agenda here.

3D ASIP has been recognized as the premier conference on 2.5 / 3DIC focused on commercialization and infrastructure. This year’s program is expanding to cover all high-density 3D packaging solutions, continuing the tradition of offering cutting-edge presentations from scientists, technologists and business leaders from across the globe.

3D ASIP is organized by

imaps

IMAPS – International Microelectronics Assembly and Packaging Society – www.imaps.org

Schedule a time to meet at the conference or ask a question about a featured product: