Temporary Bonding / Debonding Services

Processing and On-Wafer Film & Bonded Wafer Analysis
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Temporary Bonding Processing and Analysis

With over 40 years of experience in semiconductor application testing and analysis, our engineers have refined experience handling wafer sizes ranging from 100 mm to 300 mm.

This expertise, combined with our state-of-the-art temporary bonding and debonding materials, enables us to provide you with small-scale, feasibility-level temporary bonding and debonding process and analysis services.
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bonding debonding analysis

General Process

  1. Coat
  2. Bake
  3. Bond
  4. Analysis
  5. Mechanical or Thermal Debond
  6. Analysis
  7. Cleaning

*Process tailored to the specific need.

Analysis Capabilities

  1. Wafer Thickness and Uniformity
  2. On-Wafer Film Thickness and Uniformity
  3. Bonded Wafer Film Thickness and Uniformity
  4. Bond Line Quality Analysis

Learn More About Analysis Capabilities

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Temporary Bonding / Debonding Services