May 31st thru June 4th, 2022
The Electronic Components and Technology Conference (ECTC) is the premier international event that brings together the best in packaging, components and microelectronic systems science, technology and education in an environment of cooperation and technical exchange. ECTC is sponsored by the IEEE Electronics Packaging Society. In addition to Brewer Science being a panel session sponsor at ECTC, several Brewer Science employees will be presenting throughout the conference:
Luke Prenger will be presenting, Photonic Debond: Scalability and Advancements Friday, June 3rd at 10:25am
Carrier Systems for Collective Die-to-Wafer Bonding will be presented during the interactive presentation sessions on Thursday, June 2nd starting at 2pm and 4pm. Research conducted jointly with Brewer Science and Imec.
A Hybrid Bonding Interconnection with a Novel Low Temperature Bonding Polymer System will be presented during the interactive presentation sessions on Thursday, June 2nd starting at 2pm and 4pm. Research conducted jointly with Brewer Science and ITRI.